Parallel line pattern containing conductive material, method for forming parallel line pattern, substrate with transparent conductive film, device, and electronic device
A conductive material, parallel line technology, applied in conductive pattern formation, semiconductor devices, electrical components, etc., can solve the problems of long cycle time, poor material use efficiency, high cost of ITO transparent electrodes, and achieve improved characteristics and stability. Effect
Active Publication Date: 2018-04-03
KONICA MINOLTA INC
View PDF9 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Furthermore, methods such as vacuum evaporation and sputtering have problems such as long takt time and very poor material usage efficiency, and there is a big problem such as high cost of ITO transparent electrodes
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1~7 and comparative example 1、2
Embodiment 8
Embodiment 9
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| particle size | aaaaa | aaaaa |
Login to View More
Abstract
The purpose of the present invention is to provide a parallel line pattern containing a conductive material and a parallel line pattern formation method capable of improving transparency of and resistance value stability for a fine conductor pattern. The parallel line pattern is characterized by having at least one or more sets of parallel lines (10) that contain a conductive material and are formed on a substrate (2), and each set of parallel lines (10) consists of parallel lines (10) formed by conductive material being separated by movement of a fluid. The parallel line pattern formation method is characterized in that when evaporating a fluid that is linearly applied onto the substrate (2) so as to form the parallel line pattern (1) having at least one or more sets of parallel lines (10) containing the conductive material, the convective state of the linear fluid is controlled such that the conductive material is selectively deposited at edges of the linear fluid.
Description
Parallel line pattern including conductive material, method for forming parallel line pattern, substrate with transparent conductive film, device, and electronic equipment technical field The invention relates to a parallel line pattern containing conductive material, a method for forming the parallel line pattern, a base material with a transparent conductive film, a device and an electronic device. Background technique In recent years, various types of display technologies, such as liquid crystal, plasma, organic electroluminescence, and field emission, have been developed along with increasing demand for thin TVs and the like. In any of the displays with different display methods, transparent electrodes are an essential structural technology. In addition to televisions, transparent electrodes are also indispensable technical elements in touch panels, mobile phones, electronic paper, various solar cells, and various electroluminescent dimming devices. Conventionally, a...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/14H01B13/00H05K3/10
CPCG06F2203/04103H01L31/022466H01L31/1884H05K1/097H05K3/125H05K2203/0783
Inventor 大屋秀信牛久正幸山内正好新妻直人
Owner KONICA MINOLTA INC



