Electronic component package and method for manufacturing same
A technology for electronic components and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, and electrical solid-state devices, etc., can solve problems such as insufficient connection reliability of heat dissipation characteristics, and achieve the effect of improving connection reliability.
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no. 1 Embodiment approach
[0078] exist Figure 4 (a)~(g) and Figure 5 (a)-(c) show the process of the manufacturing method of this invention according to 1st Embodiment.
[0079] In this embodiment, it is characterized in that "the metal foil provided with the positioning means of an electronic component" is prepared in a process (i). Specifically, such as Figure 4 As shown in (a) and (b), as a positioning means provided in the metal foil 10, "the bank-shaped support member 20 provided in the metal foil so that the electronic component arrangement|positioning area may be surrounded" is used.
[0080] "Dike-shaped support member 20", such as by Figure 4 As can be seen from the forms shown in (a) to (g), it can also be called an "electronic component support body" because it is used to support an electronic component. The bank support member 20 is provided so as to surround the electronic component arrangement area 40 in a raised form, and is not particularly limited as long as it is used for posi...
no. 2 Embodiment approach
[0084] exist Figure 6 (a)-(f) show the process of the manufacturing method of this invention according to 2nd Embodiment.
[0085] This embodiment is characterized in that "a metal foil provided with a positioning unit (a positioning unit different from Embodiment 1)" of an electronic component is prepared in the step (i). Specifically, such as Figure 6 As shown in (a) and (b), "the recessed part 25 which dented the metal foil and provided in the electronic component arrangement area" was used as the positioning means provided in the metal foil 10.
[0086] In this second embodiment, the electronic component 50 can be more accurately arranged in the electronic component arrangement region of the metal foil without separately providing the bank-shaped support member 20 on the metal foil. That is, by using the recessed part 25, an electronic component can be arrange|positioned so that the electrode 55 of an electronic component may cover the through-hole 30 of the metal foil...
no. 3 Embodiment approach
[0092] This third embodiment is an embodiment suitable for "manufacturing a plurality of electronic component packages together". That is, according to this embodiment, a plurality of electronic component packages can be manufactured collectively. Specifically, a metal foil having a plurality of encapsulation precursor regions is used in step (i). For example, use a positioning system having a plurality of "bank-like support members 20 provided on the metal foil so as to surround the electronic component placement area" or "depressions 25 provided on the electronic component placement area by recessing the metal foil". Cell Foil. And, in the step (ii), the electronic components respectively used in the plurality of electronic component packages are arranged so as to be located on the respective regions of the plurality of packaging precursor regions (refer to Figure 7 ). As a result of passing through such steps, the "electronic component packaging precursor in which a plu...
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Abstract
Description
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