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Insulating layer material, stainless steel-based copper clad laminate, surface treatment method and preparation method

A surface treatment, stainless steel technology, applied in the surface treatment method and preparation, insulation layer materials, stainless steel-based copper clad laminates, can solve the problems of delamination cracking, delamination cracking, etc., to achieve low cost, high production efficiency, insulation Good results

Active Publication Date: 2017-08-25
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide an insulating layer material, a stainless steel-based copper-clad laminate, a surface treatment method and a preparation method, aiming at solving the problem of delamination explosion and delamination in the existing high-thermal conductivity stainless steel-based copper-clad laminate. Problems such as cracking

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] A high thermal conductivity insulating layer material, by mass parts, includes the following components:

[0049] 120 parts of bisphenol A epoxy resin;

[0050] 1 part of acid anhydride;

[0051] 5 parts of 2-ethylimidazole;

[0052] 40 parts of titanate coupling agent;

[0053] 500 parts of aluminum oxide;

[0054] 1 part of toluene.

Embodiment 2

[0056] A high thermal conductivity insulating layer material, by mass parts, includes the following components:

[0057] 100 parts of glycidyl ether epoxy resin;

[0058] 28 parts of polyamines;

[0059] 3 parts of 1-cyanoethyl-2-ethyl-4-methylimidazole;

[0060] 24 parts of silane coupling agent;

[0061] 120 parts of silicon dioxide;

[0062] 30 parts of cyclohexanone.

Embodiment 3

[0064] A high thermal conductivity insulating layer material, by mass parts, includes the following components:

[0065] 80 parts of phosphorus-containing epoxy resin;

[0066] 50 parts of acid anhydride;

[0067] 0.05 parts of 2-ethyl-4-methylimidazole;

[0068] Aluminate coupling agent 1 part;

[0069] 1 part of beryllium oxide;

[0070] 50 parts of methyl butanone.

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Abstract

The invention discloses an insulating layer material, a stainless steel-based copper-clad laminate, a surface treatment method and a preparation method, and a high thermal conductivity insulating layer material, which comprises the following components in parts by mass: 80-120 parts of epoxy resin; 1-50 parts of curing agent ; 0.05-5 parts of curing accelerator; 1-40 parts of additives; 1-500 parts of ultra-pure high thermal conductivity filler; 1-50 parts of organic solvent. The high thermal conductivity stainless steel base copper clad laminate prepared by the present invention has the following advantages: 1. High thermal conductivity, which is superior to similar products in the market; 2. Good insulation, and the breakdown voltage can reach more than 6KV; 3. High thermal conductivity and insulation The layer is well combined with the stainless steel base, and there is no delamination and bursting phenomenon under thermal shock; 4. Good machining performance, no delamination and cracking of the medium layer; 5. High production efficiency; 6. Low cost, about 1 / 2 of the products on the market 2.

Description

technical field [0001] The invention relates to the technical field of manufacturing metal-based copper-clad laminates, in particular to insulating layer materials, stainless-steel-based copper-clad laminates, surface treatment methods and preparation methods. Background technique [0002] In recent years, with the rapid development of LED lighting, high-power electrical appliances, LED, TV backlight and various power supplies, as well as the recovery after the economic crisis, the market demand for high thermal conductivity metal-based copper clad laminates has risen sharply, and a high thermal conductivity aluminum-based Copper-clad laminates are the main body, and copper-based copper-clad laminates, stainless-steel-based copper-clad laminates and special composite-based copper-clad laminates are the tributaries of the high thermal conductivity metal-based market structure. High thermal conductivity stainless steel-based copper clad laminates are mainly used in environment...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/02C08K13/02C08K3/22C08K3/36C08G59/42C08G59/50B41M1/12B41M1/28B32B37/06B32B37/10B32B37/15B32B15/092B32B15/18B32B15/20
Inventor 陈毅龙赖海平严振坤谭小林王远肖尊民
Owner KINWONG ELECTRONICS TECH LONGCHUAN