Supercharge Your Innovation With Domain-Expert AI Agents!

Workpiece processing device

A processing device and workpiece technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of inconvenient and flexible, and achieve the effect of improving workpiece processing efficiency, reducing workpiece processing cost, and convenient use

Active Publication Date: 2015-05-20
ACM RES SHANGHAI
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this machine effectively utilizes the use space of the wafer carrier to achieve the purpose of increasing production capacity and reducing costs, however, when wafers of different sizes need to be processed, the entire wafer carrier needs to be replaced accordingly. Medium, not convenient and flexible enough

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Workpiece processing device
  • Workpiece processing device
  • Workpiece processing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0028] refer to figure 1 , discloses a schematic cross-sectional structure diagram of the first embodiment of the workpiece processing device of the present invention. Such as figure 1 As shown, the workpiece processing device includes a process chamber 110 and a workpiece carrying mechanism 210 . A "workpiece" as used herein may be a wafer, substrate, substrate, or the like.

[0029] The process chamber 110 has a top wall 111, two pairs of side walls 112 and a bottom wall 113 opposite to the top wall 111. The top wall 111 of the process chamber 110, the two pairs of side walls 112 and the bottom wall 113 form a space to accommodate Workpieces are processed. A side wall 112 of the process chamber 110 is provided with a workpiece inlet ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a workpiece processing device comprising a process cavity and a workpiece bearing mechanism. The workpiece bearing mechanism comprises a support shaft, a large chuck, a plurality of small chucks, a carrying plate, a group of support columns, a first driving device and a third driving device. The large chuck is accommodated in the process cavity. An accommodating space is formed by the bottom and the side wall of the large chuck in a surrounding manner. The small chucks are accommodated in the accommodating space of the large chuck, and each small chuck comprises a chuck body. Accommodating cavities are formed in the tops of the small chucks downwardly to accommodate workpieces. Through the small chucks, when the workpieces same or different in size and shape need to be processed at the same time, the small chucks with the accommodating cavities in corresponding size and shape are selected and are placed in the accommodating space of the large chuck, and replacement of the whole large chuck is not needed, so that the workpiece processing device is convenient and flexible to use, simple in structure and capable of processing multiple workpieces at the same time, workpiece processing efficiency is improved, and workpiece processing cost is reduced.

Description

technical field [0001] The invention relates to a workpiece processing device, in particular to a workpiece processing device capable of processing multiple workpieces at the same time. Background technique [0002] With the increasingly fierce competition in the semiconductor industry, in the semiconductor process, in addition to strict requirements on process quality, manufacturers are also constantly seeking new ways to improve process efficiency and reduce process costs. This new way includes improving Processing equipment and / or improving process flow. [0003] For example, Chinese patent application CN200810126565.9 discloses a device that can process multiple substrates in batches, the device includes a chamber body, three or more support columns and a plurality of support teeth extending from the three or more support columns , slots are formed between adjacent supporting teeth to support the substrate. When processing the substrates, a plurality of substrates are ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/687
CPCH01L21/6719
Inventor 王坚贾照伟张怀东王晖
Owner ACM RES SHANGHAI
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com