Dielectric coupling systems for EHF communications

[0034] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. Reference will be made to specific embodiments of the disclosed subject matter, examples of which are illustrated in the accompanying drawings. Although the disclosed subject matter will be described in conjunction with the examples, it will be understood that it is not intended to limit the disclosed subject matter to these specific embodiments only. On the contrary, the disclosed subject matter is intended to cover alternatives, modifications and equivalents, which fall within the spirit and scope of the disclosed subject matter as defined by the appended claims. In other instances, well-known process steps have not been described in detail to avoid unnecessarily obscuring the present disclosure.

[0035] Furthermore, in the following description, numerous specific details are set forth in order to provide a thorough understanding of the presently disclosed subject matter. However, it will be apparent to those skilled in the art that the disclosed subject matter may be practiced without these specific details. In other instances, methods, procedures and elements well known to those skilled in the art have not been described in detail to avoid obscuring the subject matter of the present disclosure.

[0036] Apparatus, systems and methods for EHF communications including dielectric coupling are shown in the figures and described below.

[0037] A device that provides communication over a communication link may be referred to as a communication device or a communication unit. For example, a communication unit operating in the EHF electromagnetic band may be referred to as an EHF communication unit. An example of an EHF communication unit is an EHF communication link chip. Throughout this disclosure, the terms communication link chip, communication link chip package, and EHF communication link chip package will be used interchangeably to refer to an EHF antenna embedded in an IC package. Examples of such communication link chips are described in detail in US Patent Application Serial Nos. 13/485,306, 13/427,576, and 13/471,052.

[0038] Apparatus, systems and methods for EHF communications including dielectric coupling are shown in the figures and described below.

[0039] figure 1 In accordance with an embodiment, a side view of an exemplary very high frequency (EHF) communication chip 10 is shown with some internal components. as reference figure 1 As discussed, the EHF communication chip 10 may be mounted on a connector printed circuit board (PCB) 12 of the EHF communication chip 10 . figure 2 A similar exemplary EHF communication chip 32 is shown. It should be noted that figure 1The EHF communication chip 10 is depicted using computer simulation graphics, and thus, some components may be displayed in a stylized mode. The EHF communication chip 10 may be adapted to transmit and receive very high frequency signals. As shown, the EHF communication chip 10 may include a die 16 , a lead frame (not shown), one or more conductive connectors such as bond wires 18 , a transducer such as an antenna 20 and an encapsulation material 22 . Die 16 may include any suitable structure adapted as a small circuit on a suitable die substrate, and is functionally equivalent to a component also referred to as a "chip" or "integrated circuit (IC)." The die substrate may be formed using any suitable semiconductor material, such as, but not limited to, silicon. Die 16 may be positioned in electrical communication with the leadframe. lead frame (similar to figure 2 24) may be any suitable structure adapted to allow one or more other circuits to operably connect the conductive leads of die 16. lead frame (see figure 2 The leads of 24) can be embedded or fixed in the lead frame substrate. The leadframe substrate may be formed using any suitable insulating material configured to hold the leads in a predetermined configuration.

[0040] Furthermore, electrical communication between the die 16 and the leads of the lead frame may be accomplished by any suitable method using conductive connectors such as one or more bond wires 18 . Bond wires 18 may be used to connect points on the circuit of die 16 with corresponding leads on the lead frame. In another embodiment, the die 16 may be inverted, and conductive connectors comprising bumps or die solder balls rather than bond wires 16 may be configured in a configuration commonly referred to as a "flip chip".

[0041] Antenna 20 may be any suitable structure adapted as a transducer for converting between electrical and electromagnetic signals. The antenna 20 may be adapted to operate in the EHF spectrum and may be adapted to transmit and/or receive electromagnetic signals, in other words as a transmitter, receiver or transceiver. In embodiments, the antenna 20 may be constructed as a lead frame (see figure 2 part of 24). In another embodiment, antenna 20 may be separate from die 16, but may be operably connected to, and adjacent to, die 16 by any suitable method. For example, using an antenna bond wire (similar to figure 2 26 ), the antenna 20 may be connected to the die 16 . Alternatively, in a flip chip configuration, antenna 20 may be connected to die 16 without the use of antenna bond wires. In other embodiments, the antenna 20 may be placed on the die 16 or the PCB 12 .

[0042] Additionally, the encapsulation material 22 may hold the components of the EHF communication chip 104 in a fixed relative position. The encapsulation material 22 may be any suitable material adapted to provide electrical insulation and physical protection for the electrical and electronic components of the first EHF communication chip 10 . For example, the encapsulation material 22 may be a composite mold, glass, plastic, or ceramic. The encapsulation material 22 may be formed in any suitable shape. For example, the encapsulation material 22 may be in the form of a rectangular block encapsulating all components of the EHF communication chip except for the unconnected leads of the lead frame. Other circuits or components may be used to form one or more external connections. For example, the external connections may include pad balls and/or external solder balls for connection to a printed circuit board.

[0043] Furthermore, the EHF communication chip 10 may be mounted on the connector PCB 12 . The connector PCB 12 may include one or more laminate layers 28 , one of which may be a PCB ground plane 30 . PCB ground plane 30 may be any suitable structure adapted to provide electrical grounding for circuits and components on PCB 12 .

[0044] figure 2 A perspective view of the EHF communication chip 32 to show some of the internal components. It should be noted that figure 2 The EHF communication chip 32 is depicted using computer simulation graphics, and thus some components may be displayed in a stylized mode. As shown, EHF communication chip 32 may include die 34, lead frame 24, one or more conductive connectors such as bond wires 36, transducers such as antenna 38, one or more antenna bond wires 40 and a package Material 42. Die 34, lead frame 24, one or more bond wires 36, antenna 38, antenna bond wire 40, and encapsulation material 42 may have the same figure 1 The components of EHF communication chip 10 described in , such as die 16, lead frame, bond wires 18, antenna 20, antenna bond wires and encapsulation material 22 function similarly. Additionally, EHF communication chip 32 may include a connector PCB (similar to PCB 12).

[0045] exist figure 2 , it can be seen that the die 34 and the bond wires 26 connecting the die 34 to the antenna 38 are packaged in the EHF communication chip 32 . In this embodiment, the EHF communication chip 32 may be mounted on the connector PCB. The connector PCB (not shown) may include one or more laminate layers (not shown), one of which may be the PCB ground plane (not shown). The PCB ground plane may be any suitable structure adapted to provide electrical grounding for circuits and components on the PCB of the EHF communication chip 32 .

[0046] EHF communication chip 10 and EHF communication chip 32 may be adapted to allow EHF communication therebetween. Additionally, the EHF communication chip 10 or 32 may be adapted to transmit and/or receive electromagnetic signals, providing one-way or two-way communication between the EHF communication chips. In embodiments, the EHF communication chips may be co-located on a single PCB and may provide intra-PCB communication. In another embodiment, the EHF communication chip 114 may be located on the first PCB and the second PCB, and may thus provide inter-PCB communication.

[0047] In some cases, a pair of EHF communication chips such as 10 and 32 may be mounted far enough apart that EHF electromagnetic signals may not be reliably exchanged between them. In these cases, it would be desirable to provide improved signaling between a pair of EHF communication chips. For example, one end of a coupling device or coupling system configured for propagation of electromagnetic EHF signals can be placed adjacent to the source of the EHF electromagnetic signal, while the other end of the coupling device or coupling system can be placed in phase with the receiver of the EHF electromagnetic signal adjacent placement. The EHF communication signal may be directed from the signal source into the coupling device or coupling system, propagate along the long axis of the device or system, and be received at the signal reception. image 3 Such an EHF communication system is schematically depicted in , including a dielectric coupling device 40 adapted for propagation of electromagnetic EHF signals between EHF communication chips 10 and 32 .

[0048] The coupling device and coupling system of the present invention may be adapted to facilitate the propagation of extremely high frequency (EHF) electromagnetic signals along a dielectric body, and thus may facilitate EHF electromagnetic signals between a transmission source and transmission destination Communication.

[0049] Figure 4 A conductive body 42 is depicted adapted to have at least one major surface 44 . The conductive body 42 may comprise any suitable rigid or semi-rigid material as long as the material exhibits sufficient electrical conductivity. In embodiments of the invention, some or all of the conductive body 42 may be adapted as a component of a housing or case of an electronic device. The conductive body may have a suitable geometry as long as the conductive body includes at least one major surface. For example, the conductive body may be substantially planar. When the conductive body is substantially planar, the conductive body may define a regular shape, such as a parallelogram or a circle, or the conductive body may have an irregular shape, such as an arc. When the conductive body is non-planar, the conductive body may define a major surface that is curved so as to resemble a portion of the surface of a sphere, cylinder, cone or torus or the like.

[0050] The conductive body may define at least one elongated recess 46 in the major surface 44 . As elongated, the elongated recess 46 may have a first end 48 and a second end 50 . Additionally, the bottom of the elongated recess 46 in the conductive body 42 may be defined by the recess floor 52 . In embodiments of the invention, the conductive body 42 has at least two major surfaces, wherein the second major surface may be on an opposite side of the first major surface of the conductive body 42 . like Figure 4 As shown, the conductive body 42 may exhibit a generally planar geometry, with a generally rectangular perimeter. When the conductive body has a planar geometry, then the second major surface 54 of the conductive body 42 may be on the opposite side of the first major surface 44 of the planar conductive body.

[0051] It can be seen in this example that the elongated recess 46 and associated recess floor 52 extend in a direction generally along the first major surface 44 . When the first major surface 44 extends in a plane adjacent the elongated recess 46 , the bottom plate 52 may also be planar and may be coplanar with the plane of the first major surface adjacent the elongated recess 46 . As will be seen in some examples, the bottom plate may also extend in a direction transverse to the plane adjacent the first major surface of the elongated recess 46 .

[0052] Also as Figure 4 As shown, the bottom plate 52 of the elongated recess 46 may define a hole 56 . Aperture 56 may extend through base plate 52 such that aperture 56 extends to second major surface 54 of conductive body 52 . In an embodiment, the holes 56 may be formed as slits.

[0053] like Figure 5 As shown, the elongated recess 46 of the conductive body 42 may include a dielectric body 58 that forms a dielectric coupling, the dielectric body 58 including a first dielectric material extending along the longitudinal axis of the elongated recess 46 . The dielectric body 58 may be referred to as a waveguide or a dielectric waveguide, and is typically adapted to guide (or propagate) polarized EHF electromagnetic signals along the length of the dielectric body. The dielectric body 58 preferably includes a first dielectric material having a dielectric constant of at least about 2.0. Materials with significantly higher dielectric constants may reduce the preferred dimensions of the elongated body due to the reduction in wavelength of the EHF signal as it enters materials with higher dielectric constants. Preferably, the elongated body comprises a plastics material which is a dielectric material.

[0054] In embodiments of the invention, the dielectric body has a longitudinal axis that is substantially parallel to the longitudinal axis of the elongated recess, and a cross-section of the dielectric body 58 orthogonal to the longitudinal axis shows the largest dimension spanning along the cross-section The major axis of the cross section extending, and the minor axis of the cross section extending across the cross section along the largest dimension of the cross section, the major axis being at right angles to the minor axis. For each such cross-section, the cross-section has a first dimension along its major axis and a second dimension along its minor axis. To enhance the ability of the dielectric bodies 58 to propagate electromagnetic EHF signals internally, each dielectric main body may be appropriately dimensioned such that the length of the first dimension of each cross-section is greater than the wavelength of the electromagnetic EHF signal to be propagated along the conduit; and the second dimension is smaller than the wavelength of the electromagnetic EHF signal to propagate along the conduit. In an alternative embodiment of the invention, the first dimension is greater than 1.4 times the wavelength of the electromagnetic EHF signal to be propagated, and the second dimension is no greater than about half the wavelength of the electromagnetic EHF signal to be propagated.

[0055] The dielectric body 58 may have any of a variety of possible geometries, but is typically adapted to substantially occupy the elongated recess 46 . The dielectric body 58 may be shaped such that each cross-section of the dielectric body 58 has a profile formed by some collection of straight and/or continuously curved line segments. In an embodiment, each cross-section has an outline that defines a rectangle, a circular rectangle, a playground shape, or a hyperellipse, where a hyperellipse includes a shape that includes an ellipse and a hyperellipsoid.

[0056] In embodiments, and as Figure 5 As shown, the dielectric body 58 defines an elongated cuboid. That is, the dielectric body 58 may be plasticized such that at each point along its longitudinal axis, a cross-section of the dielectric body 58 orthogonal to the longitudinal axis defines a rectangle.

[0057]The dielectric body 58 may have an upper or mating surface 59, at least a portion of which may be continuous and/or coplanar with the first major surface 44 surrounding and adjacent to the first elongated recess. In some embodiments, the upper surface 59 may be raised above the first major surface 44 or recessed below the first major surface 44 , or partially raised and partially recessed relative to the first major surface 44 .

[0058] Image 6 show Figure 5 A cross-sectional view of the dielectric coupling device 41. As shown, the dielectric coupling device 41 includes a dielectric end piece 60 placed at the first end 48 of the dielectric body 58 and extending through the hole 56 in the conductive body 42 . The dielectric end piece 60 helps guide any EHF electromagnetic signals propagating along the dielectric body 58 to the transmission destination, such as the integrated circuit package 62 . In an embodiment, the apertures 56 may be formed as slits with narrow dimensions less than half the wavelength of the desired EHF signal to be transmitted, as measured in the dielectric material, and broad dimensions greater than one such wavelength. In particular embodiments, the apertures 56 may be well-defined slits measuring approximately 5.0 mm and 1.6 mm.

[0059] In another embodiment of the invention, a dielectric coupling device as described above can be adapted such that it can cooperate with a complementary second dielectric coupling device such that they combine to form a dielectric coupling system. For example, when each conductive body defines a recess in a major surface of the conductive body, the conductive bodies may mate in a face-to-face relationship such that the recesses collectively form an elongated cavity. The combined conductive bodies may define a conductive housing in such a way that the dielectric bodies of each coupler overlap each other to form a collective dielectric body adapted to conduct EHF electromagnetic signals along the conductive body .

[0060] For example, and as Figure 7 As shown, the first dielectric coupling device 41 mates with a complementary second dielectric coupling device 63 in such a way that the first dielectric body 58 overlaps the second dielectric body 64 to form a gathered dielectric body 65 . At the same time, the second conductive body 66 of the second dielectric coupling device 63 may cooperate with the first conductive body 42 to form a conductive housing that at least partially surrounds the aggregated dielectric body 65 formed by the dielectric bodies 58 and 64, and Shielding of EHF electromagnetic signals propagating between an EHF transmission source and destination, such as communication chips 62 and 68, for example, is thus provided. The desired EHF electromagnetic signal may pass through holes 56 and 72 placed at each end of the gathered dielectric body 65 and extending through holes 56 and 72 in the conductive housing defined by the first conductive body 42 and the second conductive body 66, respectively. The first dielectric end piece 60 and the second dielectric end piece 70 are guided in and out of the gathered dielectric body 65 . The dielectric components of the resulting coupled system may, but need not, be in direct mechanical or physical contact. If the dielectric components are positioned with relative spacing and orientation that allow the desired EHF electromagnetic signals to be transmitted and/or propagated, then the spacing and orientation are appropriate spacing and orientations for the coupled system.

[0061] For example, the structure of the combined dielectric coupling system 72 may be beneficial to minimize stray radiation transmission by impairing the function of the single component dielectric coupling device 41 until two complementary dielectric coupling devices cooperate to form a corresponding coupling system.

[0062] like Figure 7 As shown, the first device 41 and the second device 63 may be symmetrically related by an imperfect rotation, also known as rotoflection or rotoflection. That is, the geometry of the first device 41 and the second device 63 can be related by a 180 degree rotation and reflection with a plane orthogonal to the axis of rotation. In the case of devices 41 and 63, the two coupling devices share a common geometry and are simply placed relative to each other in a suitable relationship to form the desired coupling system. In alternative embodiments, one or other coupling devices may be uniquely shaped such that they can be assembled using rotational symmetry, but not using undesired geometries.

[0063] The dielectric coupling system of the present invention provides somewhat robust transmission of EHF electromagnetic signals. For example, as Figure 8 As shown, EHF electromagnetic signals can be successfully transmitted from integrated circuit package 62 to integrated circuit package 68 even with air gap 71 between first dielectric body 58 and second dielectric body 64 . For example, it has been determined that successful communication between integrated chip packages is possible even when the gap 71 is 1.0 mm large. By not requiring physical contact between dielectric bodies to facilitate EHF electromagnetic communication, the dielectric coupling system of the present invention can provide additional degrees of freedom when incorporating the coupling system into an EHF communication system. For example, two coupling devices can be used in a coupled system that must be able to switch longitudinally while maintaining the integrity of the EHF electromagnetic waveguide. Where the two dielectric bodies are in physical contact, this movement can cause friction and wear on the dielectric bodies, resulting in premature failure of the coupling system. However, by providing a gap between the first and second dielectric bodies, the transition between the two coupling means can advantageously take place sufficiently without friction between the dielectric bodies.

[0064] In addition, if Figure 9 As shown, EHF electromagnetic communication between integrated circuit package 62 and integrated circuit package 68 can be maintained even when dielectric bodies 58 and 64 are not longitudinally aligned, as well as when installing, adjusting, or operating the dielectric coupling of the present invention. , giving additional mechanical degrees of freedom.

[0065] As discussed above, the first and second dielectric bodies may include planar mating surfaces that may be at least partially continuous and/or coplanar with major surfaces surrounding and adjacent their respective elongated recesses. Alternatively, the first and second dielectric bodies may have alternative geometries if they are still adapted to form aggregated dielectric bodies when superimposed. In an embodiment, each dielectric body may be beveled in such a way that each dielectric body forms an elongated right-angled prism of dielectric material that is plasticized and dimensioned so that when combined they form a collection of elongated cubes Dielectric body. like Figure 10 As shown in, each of the first beveled dielectric body 72 and the second beveled dielectric body 74 are beveled across their widths, and the slope of each bevel is selected so that when the dielectric bodies 72 and 74 are superimposed in the desired direction, the aggregated The dielectric body forms an elongated cube of dielectric material. The resulting aggregated dielectric body joins with dielectric ends 60 and 70 to form a dielectric waveguide extending between integrated circuit packages 62 and 68 . Various alternative complementary dielectric body geometries are envisioned, such as dielectric bodies designed to each be half the width, thickness or length of a desired aggregated dielectric body; or designed to have partial or discontinuous lengths or widths; Or be designed in some other symmetrical or asymmetrical complementary shape and size.

[0066] As discussed above, when the first and second dielectric ends extend through first and second holes, respectively, defined in the conductive body surrounding the aggregated dielectric body, the dielectric ends are adapted to transfer the desired EHF electromagnetic Signals are directed into and/or out of the concentrated dielectric body. Typically, both the source of the EHF electromagnetic signal and the receiver of the EHF electromagnetic signal are placed adjacent to one of the ends of the dielectric to facilitate transmission of the EHF electromagnetic signal. When the source and/or destination of the EHF electromagnetic signal includes a transducer, the transducer is typically adapted to transmit or receive the EHF electromagnetic signal, and is typically placed adjacent to one of the dielectric ends in such a way that: a or multiple transducers are properly aligned with adjacent dielectric end pieces between which EHF electromagnetic signals can be sent.

[0067] Figure 11 A dielectric coupling device 76 according to an alternative embodiment of the present invention is depicted. The dielectric coupling device 76 includes a conductive body 78 , a dielectric body 80 placed in a recess in the conductive body, a dielectric end piece 82 extending through a hole in the conductive body 78 , and an associated integration with the dielectric end piece 82 placed adjacent to it Circuit package 84 . Additionally, the dielectric coupling device 76 includes a dielectric cover 86 extending over the dielectric body 80 . Dielectric cover 86 may be formed of the same or different material as dielectric body 80 , and may also be separate from dielectric body 80 or integrally formed with dielectric body 80 . The dielectric cover 86 may exhibit a desired shape or geometry, but is typically thin enough that the dielectric cover will not substantially conduct the EHF electromagnetic signal of interest separate from the dielectric body. The dielectric cover 86 may have a decorative shape, such as depicting a company logo or other decoration, or the cover may serve a useful purpose, such as providing a guide to aid in the alignment of the coupling device. Alternatively, or in addition, the dielectric cover 86 may be used to conceal the configuration and/or geometry of the coupling device 76 from a user or other observers.

[0068] Figure 12-22 Selected additional embodiments of the dielectric coupling devices and/or coupling systems of the present invention are depicted. Throughout Figure 12-22 , the same numerals may be used to designate identical or functionally similar elements.

[0069] Figure 12 and 13 A dielectric coupling device according to an embodiment of the present invention is depicted including a conductive body 90 that defines a recess, and a dielectric body 92 that is placed in the defined recess. as above about Figure 11 discussed, Figure 12 and 13 The dielectric body 92 is covered by a conductive cover 94, and the conductive cover defines a first hole 96 and a second hole 96' adjacent to the first and second ends of the dielectric body 92, respectively. Adjacent to hole 96 and hole 96' are a first integrated circuit package 98 and a second integrated circuit package 98', respectively. EHF electromagnetic signals transmitted between the first integrated circuit package 98 and the second integrated circuit package 98' first pass through the first aperture 96 in the conductive cover 94 and then propagate along the length of the dielectric body 92, through the second aperture 96 ', and into the second integrated circuit package 98'.

[0070] Figure 14 and 15 A dielectric coupling device according to an alternative embodiment of the present invention is depicted comprising a conductive body 90 and a dielectric body 92 placed opposite a surface of the conductive body 90 and covered by a conductive cover 94 . The dielectric body 92 extends beyond the conductive cover 94 at each end, allowing EHF electromagnetic signals to pass between the first integrated circuit package 98 and the second integrated circuit package 98'.

[0071] Figure 16 and 17 A dielectric coupling device according to another embodiment of the present invention is depicted including a conductive body 90 defining a recess, wherein the recess floor defines a first aperture 96 and a second aperture 96" at each end of the recess. Apertures 96 and 96' extend through the conductive body to the opposite major surface of the conductive body 90. The dielectric body 92 is placed within the defined recess and the first dielectric end 97 extends through the first hole 96 from the dielectric body 92 to the conductive body The opposite major surface of the conductive body 90, and the second dielectric end portion 97' extends from the dielectric body 92 through the second hole 96' to the opposite major surface of the conductive body 90. Adjacent the holes 96 and 96', respectively, are the first integrated Circuit package 98 and second integrated circuit package 98'. For example, an EHF electromagnetic signal sent from first integrated circuit package 98 to second integrated circuit package 98' first passes through first dielectric end 97 in first aperture 96, and then Propagates along the length of the dielectric body 92, through the second dielectric end portion 97' in the second hole 96', and into the second integrated circuit package 98'.

[0072] Figure 18 and 19A dielectric coupling device including a non-planar conductive body 90 is depicted in accordance with another embodiment of the present invention. The first major surface of the conductive body 90 is a curved surface including a recess defined in the curved surface and a dielectric body 92 placed within the recess. A hole 96 in the conductive body 90 is defined by the bottom plate of the recess, and a dielectric end 97 extends from the dielectric body 92 into the hole 96 . A first integrated circuit package 98 is placed adjacent to the first end of the dielectric body 92, while a second integrated circuit package 98' is placed adjacent to the dielectric end 97. The EHF electromagnetic signal sent from the first integrated circuit package to the second integrated circuit package first enters the first end of the dielectric body 92, then propagates along the curved length of the dielectric body, through the dielectric end 97 in the hole 96, and thus enters The second integrated circuit package 98'.

[0073] Figure 20 Depicting a dielectric coupling according to another embodiment of the present invention that includes placing a first integrated circuit package 98 adjacent a first end of a first dielectric body 92 that is planar and has a smooth Curve outline. When the second integrated circuit package 98' is placed adjacent to the end of the second dielectric body 92', the first dielectric body 92 is substantially the same as the second dielectric body, which is also planar and curved, albeit on the opposite side of the first integrated circuit package. 92' stacked and aligned. The depicted dielectric coupling allows EHF electromagnetic signals to be communicated between the first integrated circuit package and the second integrated circuit package even when the first dielectric body 92 and the second dielectric body 92' are rotationally translated. The freedom of movement between the first and second dielectric bodies can be increased by separating the first and second dielectric bodies by a small gap, which does not substantially affect the transmission of EHF electromagnetic signals.

[0074] Figure 21 and 22 A dielectric coupling is depicted according to another embodiment of the present invention, the dielectric coupling comprising a first coupling means and a second coupling means. The first coupling means includes a first conductive body 90 defining a curved surface. A recess is defined along the inner surface of the first conductive body 90, and a dielectric body 92 is placed within the first recess. A first hole 96 is defined in the conductive body 90 , and a first integrated circuit package 98 is positioned adjacent the first hole 96 . A second coupling device comprising a second curved conductive body 90' is placed within the curve of the first coupling device, and a second elongated recess is defined in the second conductive body 90' along the outer surface of the second conductive body 90' . The first and second coupling means are adapted such that the second dielectric body 92' placed in the second elongated recess is substantially aligned with and substantially overlapping the first dielectric body 92' of the first coupling means. The second coupling means also includes a second aperture 96' defined by the conductive body 90' extending through the second conductive body 90' to an adjacent second integrated circuit package 98'. EHF electromagnetic signals transmitted between the first and second integrated circuit packages enter the first dielectric body 92 from the integrated circuit package 98 via the aperture 96 . The signals then propagate along the aggregated dielectric body formed by the first dielectric body 92 and the second dielectric body 92' and then through the second aperture 96', where they can be received by the second integrated circuit package 98'. similar to Figure 19 and 20 The dielectric coupling of , if there is sufficient coverage between the dielectric bodies, even when the first dielectric body 92 and the second dielectric body 92' are translated along their respective curves, Figure 21 and 22 The dielectric coupling also allows EHF electromagnetic signals to be transmitted between the first and second integrated circuit packages. The freedom of movement between the first and second dielectric bodies can be increased by providing a small gap between the first and second dielectric bodies, which does not substantially affect the transmission of EHF electromagnetic signals.

[0075] like Figure 23 As shown in flowchart 100 in , the dielectric coupling of the present invention has particular properties for a communication method using EHF electromagnetic signals. The method may include mating a first coupling assembly and a second coupling assembly to form a coupling at step 102, wherein each coupling assembly includes a conductive body having a first major surface, wherein each conductive body is defined in the first major surface Elongated recesses, each elongated recess having a base plate, and each elongated recess having a dielectric body disposed therein. Mating the first coupling assembly and the second coupling assembly may include contacting major surfaces of the conductive bodies of the coupling assemblies at step 104 such that the conductive bodies of the coupling assemblies form a conductive housing, and the dielectric body of each coupling assembly is coupled to the other The dielectric bodies of the assemblies are stacked and form the dielectric conduits. The method may also include propagating the EHF electromagnetic signal along the generated dielectric conduit at step 106 .

[0076] It is to be understood that the phraseology or terminology herein is for the purpose of description and not limitation to enable those skilled in the art to understand the terminology or phraseology of this specification in light of teaching and guidance.

[0077] While the present disclosure is amenable to various modifications and alternative forms, specific embodiments are illustrated and described in detail by way of example in the drawings. It should be understood, however, that the drawings and detailed description are not intended to limit the present disclosure to the particular form disclosed, but on the contrary, the intention is to cover other aspects falling within the spirit and scope of the present disclosure as defined by the appended claims. All modifications, equivalents and alternatives.