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Electro/mechanical microchips and method of making with burst ultrafast laser pulses

An electromechanical and chip technology, applied in the field of electrical/mechanical microchips, can solve problems such as failure to achieve, and achieve the effect of less waste

Active Publication Date: 2015-05-27
ROFIN SINAR TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Others have tried unsuccessfully to create microchannels in bulk glass using laser alteration and etching

Method used

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  • Electro/mechanical microchips and method of making with burst ultrafast laser pulses
  • Electro/mechanical microchips and method of making with burst ultrafast laser pulses
  • Electro/mechanical microchips and method of making with burst ultrafast laser pulses

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Embodiment Construction

[0046] The more important features of the invention have been thus generally, rather roughly, described in order to enable a better understanding of the ensuing detailed description and thus a better understanding of the invention's contribution over the prior art. There are, of course, additional features of the invention which will be described hereinafter and which will form the subject of the claims appended hereto.

[0047] Various embodiments and aspects of the invention will be described with reference to details discussed later. The following description and drawings are illustrative of the content of the invention and are not intended to be limiting of the content. Numerous specific details are described in order to provide a thorough understanding of various embodiments of the invention. In some instances, however, well known or conventional details are not described in order to provide a concise discussion of embodiments of the invention.

[0048] In this regard, ...

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Abstract

A method for making an electromechanical chip using a plurality of transparent substrates, comprising the steps of: machining, using photoacoustic compression, full or partial voids in at least one of the plurality of substrates. The plurality of transparent substrates are stacked and arranged in a specific order. The transparent substrates are affixed and sealed together. The chip may be sealed by laser welding or adhesive.

Description

[0001] This patent application claims priority and benefit to US Provisional Patent Application Serial No. 61906326, filed November 19, 2013. US Provisional Patent Application Serial No. 61906326, filed November 19, 2013, is hereby incorporated by reference in its entirety. [0002] This patent application claims priority and benefit to US Provisional Patent Application Serial No. 61906315 filed November 19, 2013. US Provisional Patent Application Serial No. 61906315, filed November 19, 2013, is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to an extremely miniaturized low cost electrical / mechanical microchip. Background technique [0004] The present invention relates to an extremely miniaturized low cost electrical / mechanical microchip. Microchips produced by the present invention are suitable for single use. Material selection from transparent materials such as glass, Si, LiTiO 3 , LiNbO 3 , transparent ceram...

Claims

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Application Information

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IPC IPC(8): B23K26/53B23K26/382B23K26/046
CPCB81C1/00634B81C2203/038C03B33/0222B81C2201/019B81C2203/036B23K26/382B23K26/40C03B33/04H01L2924/0002B23K26/356B23K2103/50H01L2924/00B81C1/00B81C3/00B81C1/00238B23K26/0626H01L25/0756H01L25/0657H01L25/117B23K26/0648B23K26/0624B23K26/0604H01L25/043
Inventor S·A·侯赛尼
Owner ROFIN SINAR TECH
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