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Solid-state imaging element, manufacturing method, and electronic device

A camera element, solid-state technology, used in electrical components, electric solid-state devices, televisions, etc., can solve the problem of image quality degradation, unable to fully face the problems of pixel miniaturization, flicker or ghosting, etc., and achieve the effect of good image quality.

Active Publication Date: 2019-05-10
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this configuration, there is a concern of image quality degradation such as flicker or ghosting due to the influence of reflected light reflected by metal materials incident on the optical system again
[0009] In addition, using an organic material such as a photosensitive resin, for example, in practice, in order to exhibit sufficient absorption performance by setting the pixel separation of pixels to about 1 μm, a wide groove width of about 0.5 μm or more is required, and There is a concern that the miniaturization of pixels cannot be adequately addressed

Method used

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  • Solid-state imaging element, manufacturing method, and electronic device
  • Solid-state imaging element, manufacturing method, and electronic device
  • Solid-state imaging element, manufacturing method, and electronic device

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Embodiment Construction

[0033] Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the accompanying drawings.

[0034] figure 1 is a diagram showing a configuration example of the first embodiment of the solid-state imaging element to which the present invention is applied.

[0035] The solid-state imaging element 11 is constituted by a plurality of pixels 12 planarly arranged in an array, and a pixel separating portion 14 is formed in a semiconductor substrate 13 in order to separate the pixels 12 . figure 1 A cross-sectional configuration example of the solid-state imaging element 11 at the pixel separating section 14 for separating the two pixels 12-1 and 12-2 is shown.

[0036] The pixel 12-1 includes a PD 21-1, a color filter 22-1, and a microlens 23-1, and the pixel 12-2 includes a PD 21-2, a color filter 22-2, and a microlens 23-2. Thus, the pixels 12 - 1 and 12 - 2 are constructed in the same manner, and when there is no ...

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Abstract

The invention provides a solid-state imaging element, a manufacturing method and electronic equipment. This solid-state imaging element includes: a semiconductor substrate in which a plurality of photodiodes are arranged in a plane; a separation portion for separating the photodiodes, wherein the separation portion has a material having a high light absorption coefficient and a high quantum efficiency filled with to a photoelectric conversion portion formed in a trench formed in the semiconductor substrate. The present invention enables acquisition of images with better image quality.

Description

technical field [0001] The present invention relates to a solid-state imaging element, a manufacturing method, and electronic equipment, and more particularly, to a solid-state imaging element, a manufacturing method, and electronic equipment capable of acquiring images with better image quality. Background technique [0002] In the related art, for example, a solid-state imaging element such as a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) image sensor is used for an electronic device provided with an imaging function such as a digital still camera or a digital video camera. in the device. A solid-state imaging element includes pixels in which a photodiode (PD) for photoelectric conversion and a plurality of transistors are combined, and an image is constructed from pixel signals output from the plurality of pixels arranged in a plane. [0003] Such a solid-state imaging element is configured such that pixels are physically separated fro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146
CPCH01L27/14623H01L27/14627H01L27/1464H01L27/14685H01L27/14689H01L27/14612H01L27/14621H01L27/1463H04N25/62H01L27/14638H04N25/77
Inventor 久保井信行
Owner SONY CORP