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A potting process method for high-density electrical connectors

A technology of electrical connectors and process methods, applied in the directions of connection, assembly/disassembly of contacts, circuit/collector parts, etc., can solve the problems of inability to transmit continuously and evenly, prone to cracks, and failure of potting, etc. Achieve the effect of improving assembly quality, reducing air bubbles, and ensuring high consistency

Active Publication Date: 2017-03-15
BEIJING SATELLITE MFG FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the existence of air bubbles and cavities, whether it is the internal stress in the colloid or the external stress, it cannot be transmitted continuously and evenly, resulting in the concentration of stress in the air bubbles and cavities, which is prone to cracks or cracks, and the potting fails.

Method used

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  • A potting process method for high-density electrical connectors
  • A potting process method for high-density electrical connectors
  • A potting process method for high-density electrical connectors

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Experimental program
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Embodiment Construction

[0034] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0035] The invention can well fill the gap between pins of the high-density electric connector during potting by selecting potting glue with good fluidity. The way of primer is used to fix the terminal first, which is beneficial to the leveling of the terminal. After the terminal is leveled, the potting of the connector is carried out. Use the iron wire to pick up the potting glue that has been de-bubbled, and then use the defoaming air gun to blow the glue on the wire into the potting part. The wire moves along the horizontal gap of the terminal. Using the de-foaming air gun to blow the glue, this potting process can make the glue solution evenly pot the connector cavity layer by layer, so that there is no dead angle in the potting, and no unpotted cavity will affect the potting quality.

[0036] The specific implementation steps of the presen...

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Abstract

The invention relates to a potting process method of a high-density electrical connector. According to the potting process, an appropriate potting adhesive is selected, and the potting process that a metal wire is in adhesive picking matching with blowing equipment to blow the adhesive is adopted; the potting process is accurately controlled, so as to pot the high-density electrical connector without cavities, and the requirement of high reliability of an installation product of the high-density electrical connector is satisfied; tests show that by using the potting process, the installation quality of the high-density electrical connector can be increased, and firm fixing of pin terminals is guaranteed; according to the potting process, the potting of the high-density electrical connector is realized without bubbles, and the insulating property between the terminals and the high reliability in installation are guaranteed; the potting quality is increased. The potting process can be applied to potting the electrical connector of which the pin spacing is less than 2 mm.

Description

technical field [0001] The invention relates to a potting process method of a high-density electrical connector, belonging to the technical field of potting of electrical connectors. Background technique [0002] For nano-miniature electrical connectors with a pin pitch of 0.635mm, they can only be assembled by crimping. Different from conventional crimping connectors with insulator locking devices, high-density crimping electrical connectors need to fill the crimping parts with insulating glue after the pins are densely spaced, so that the crimping The components are fixed, and at the same time, the insulation requirements between the crimping points are met. The potting process is completely different from the previous electrical connector assembly process, [0003] Due to the small space of the tail cover of the nanominiature electrical connector and the high density of the pins, the generation of air bubbles and cavities should be avoided during the potting process of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/00H01R43/24
CPCH01R43/24
Inventor 袁翠萍叶媛媛夏占军
Owner BEIJING SATELLITE MFG FACTORY
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