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Anode phosphorus copper with variable area and application method thereof

A phosphor copper and anode technology, applied in the direction of the electrode, can solve the problem of reducing the current anode area and achieve the effect of changing and realizing the area

Inactive Publication Date: 2015-06-10
东又悦(苏州)电子科技新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the design of the electroplating equipment has been fixed, it can only be dealt with by reducing the current and reducing or increasing the anode area to suit the control of electroplating thickness and copper ion concentration

Method used

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  • Anode phosphorus copper with variable area and application method thereof
  • Anode phosphorus copper with variable area and application method thereof

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Embodiment Construction

[0015] The present invention will be further described below in conjunction with the embodiments shown in the accompanying drawings.

[0016] like figure 1 The variable-area anode phosphor copper shown is constructed from a plurality of phosphor copper blocks 1 , and its specific shape has no fixed pattern, and can be constructed and combined according to the actual shape of the phosphor copper blocks 1 .

[0017] The phosphor bronze block 1 includes a phosphor bronze block body 11 , protrusions 12 and concave holes 13 . Wherein, there are several protrusions 12, which are evenly distributed on any surface of the phosphor bronze block body 11, and of course the same number of protrusions 12 can be respectively arranged on multiple surfaces of the phosphor bronze block body 11 as required; There are also multiple holes 13, the number of which can be consistent with the number of protrusions 12, which are also embedded on the surface of the phosphor bronze block body 11, and ca...

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PUM

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Abstract

The invention relates to an anode phosphorus copper with a variable area, and an application method thereof. The anode phosphorous copper with the variable area is constructed by a plurality of phosphorous copper blocks. Each of the plurality of phosphorous copper blocks comprises a phosphorous copper block body, a plurality of protrusions integrally arranged on any surface of the phosphorous copper block body, and a plurality of recessed holes that are embedded in other surfaces of the phosphorous copper block body and corresponding to the protrusions. The anode phosphorous copper with the variable area is constructed by the plurality of phosphorous copper blocks; surfaces of each phosphorous copper block are provided with the protrusions and the corresponding recessed holes; accordingly, the protrusions of one phosphorous copper block can be snapped into the recessed holes of another phosphorous copper block, thereby constructing the anode phosphorous copper whose area changes with the number of the phosphorus copper blocks; therefore, the change of the area of the anode phosphorous copper is achieved.

Description

technical field [0001] The invention belongs to the field of electroplating electrode materials, and relates to an anode phosphor copper, in particular to an anode phosphor copper with a variable area and a use method thereof. Background technique [0002] Anode phosphor copper is the main electroplating material in the copper plating process and is the source of copper ions. Due to the different cathode areas of the items to be plated, the anode area of ​​phosphor copper as the raw material for electroplating also needs to be replaced accordingly. However, since the design of the electroplating equipment has been fixed, it can only be dealt with by reducing the current and reducing or increasing the anode area to suit the control of the electroplating thickness and copper ion concentration. How to realize the control of the anode phosphor copper area, so as to ensure the stability of the electroplating process and electroplating equipment, has become a common problem in t...

Claims

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Application Information

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IPC IPC(8): C25D17/12
Inventor 刘东杰刘嘉惠
Owner 东又悦(苏州)电子科技新材料有限公司
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