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A test equipment for welding gold wire tension and gold ball shear force

A testing equipment and tensile testing technology, applied in the direction of testing material strength by applying stable shear force, testing material strength by applying stable tension/pressure, etc., can solve problems such as manual measurement inaccuracy, product failure, etc., to prevent dithering effect

Active Publication Date: 2018-04-27
SINY OPTIC COM CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a test equipment for measuring the tensile force of welding gold wire and the shearing force of gold balls, so as to solve the existing problems of manual measurement inaccuracy and product failure.

Method used

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  • A test equipment for welding gold wire tension and gold ball shear force
  • A test equipment for welding gold wire tension and gold ball shear force
  • A test equipment for welding gold wire tension and gold ball shear force

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Embodiment Construction

[0021] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0022] Such as figure 1 As shown, a test device for welding gold wire tension and gold ball shear force includes a workbench 1, a gold ball shear force test device 2 arranged on the workbench 1, a gold wire tension test device 3 and a microscope device 4.

[0023] Such as figure 2 As shown, the workbench 1 includes a fixture platform 11 , a rotary table 12 for controlling the horizontal rotation of the fixture platform 11 and two mutually perpendicular guide rails 13 for the horizontal movement of the fixture platform.

[0024] Such as image 3 As shown, the gold ball shear test device 2 includes a horizontal mobile platform 21, a first support 22 vertically installed on the horizontal mobile platform 21, a push...

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PUM

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Abstract

The invention relates to a testing device for welding gold wire pulling force and gold ball shearing force, comprising a workbench, a gold ball shearing force testing device, a gold wire pulling force testing device and a microscope device. The working table includes a fixture platform, a rotating platform and two mutually perpendicular guide rails for the horizontal movement of the fixture platform. The golden ball shear force testing device includes a horizontal moving platform, a first support, a push knife support and an adjustment rod for adjusting the height of the push knife support, and a sensor and a shear force controller for testing shear force are arranged in the push knife support. The gold wire tension testing device includes a second bracket, a tension testing main body, a crochet hook adapter rod and a suspender for adjusting the height of the crochet hook transition stick, and a tension testing sensor and a tension controller are arranged in the tension testing main body. The invention can adapt to the measurement and observation of different detected objects through adjustment, and transmits the force signal to the peripheral computer equipment through the sensor, so that the curve diagram of the force changing with time in the whole process can be observed conveniently.

Description

technical field [0001] The invention relates to a mechanical measuring instrument, in particular to a testing device for measuring the pulling force of welding gold wire and the shearing force of gold balls. Background technique [0002] The integration of circuits and semiconductor devices promotes the continuous improvement of packaging. Although the general trend is to integrate on silicon chips, the number of circuits that can be fabricated on a silicon chip has certain limitations in actual development, so it is still It is necessary to interconnect the chip to an organic or ceramic first-level package, and the electrical connection between the chip and the package is called chip-level interconnection. Wire bonding is a type of chip-level interconnection and the earliest interconnection method used in semiconductor devices. Over the years, it has been struggling to overcome the shortcomings in reliability, manufacturability and cost. Therefore, in the semiconductor ind...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/08G01N3/24
Inventor 李军
Owner SINY OPTIC COM CO