Wafer alignment mark
A technology for aligning marks and wafers, applied in electrical components, electric solid-state devices, circuits, etc., can solve the problems of affecting wafer bonding accuracy, waste of resources, and reducing the effective area of the chip, and achieve a large effective area of the chip. Effect
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[0017] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.
[0018] The invention discloses a wafer alignment mark. The alignment mark can be applied in the bonding process of wafers. The wafer is provided with cutting lines intersecting each other, and a tip pattern is provided on the crossing area of the cutting lines. alignment marks, and the tip pattern extends into non-intersecting areas of the dicing lanes.
[0019] In a preferred embodiment of the present invention, the above-mentioned cutting lines may include horizontal cutting lines and vertical cutting lines perpendicular to each other.
[0020] On this basis, further, the angle formed between the alignment mark and the horizontal cutting line is not 0°, preferably, the value range of the angle between the alignment mark and the horizontal cutting line is 30°-60°( For example 30°, 45°, 50° o...
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