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A kind of triaxial capacitive mems acceleration sensor and preparation method

An acceleration sensor, capacitive technology, applied in the direction of measurement of acceleration, multi-dimensional acceleration measurement, speed/acceleration/shock measurement, etc., can solve problems such as high technical thresholds, and achieve the effect of simple preparation process, good consistency and repeatability

Inactive Publication Date: 2017-12-29
NANJING ZHONGNUOSITE SENSOR SCI & TECH
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  • Abstract
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Problems solved by technology

[0004] MEMS accelerometer is the basic component of inertial sensor series products, which requires special MEMS processing technology and has a high technical threshold

Method used

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  • A kind of triaxial capacitive mems acceleration sensor and preparation method
  • A kind of triaxial capacitive mems acceleration sensor and preparation method
  • A kind of triaxial capacitive mems acceleration sensor and preparation method

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Embodiment Construction

[0038] Specific implementation

[0039] The technical details and structural features of the present invention will now be described in detail with reference to the drawings.

[0040] A three-axis capacitive MEMS acceleration sensor includes an SOI silicon substrate, an acceleration sensitive mass unit and a glass substrate. The acceleration-sensitive mass unit is composed of a horizontal axis detection unit and a parallel plate detection unit. See figure 1 , A horizontal axis detection unit is provided on the front of the SOI silicon substrate. The horizontal axis detection unit is a fixed-tooth bias type capacitance sensor, and the horizontal axis detection unit detects and feeds back the capacitance signal of the X axis and the capacitance signal of the Y axis. See figure 2 , There is a groove on the back of the SOI silicon substrate. There is a parallel plate detection unit in the groove, see figure 2 . A communicating hole communicating with the front surface of the SOI ...

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Abstract

Aiming at the problem of European and American countries monopolizing and embargoing high-precision MEMS acceleration sensors, the present invention provides a three-axis capacitive MEMS acceleration sensor and a preparation method: the acceleration sensor described in the present invention includes an SOI silicon substrate, an acceleration-sensitive mass block unit and glass substrate. The acceleration-sensitive mass block unit is composed of two parts: a horizontal axis detection unit and a parallel plate detection unit. The preparation method described in the present invention includes preparation, first photolithography, second photolithography, silicon-glass bonding, third photolithography, deposition of highly doped polysilicon, fourth photolithography, and second photolithography. Five photolithography and nine steps for structure release. The beneficial technical effect is that the acceleration sensor of the present invention uses the same acceleration-sensitive mass block unit to realize cross-interference-free detection of three-axis acceleration. It has long-term stability and good reliability, and can meet the needs of acceleration detection in special fields.

Description

Technical field [0001] The invention belongs to the technical field of sensor preparation, and in particular relates to a three-axis acceleration sensor based on SOI technology that can be used in the military industry, the automotive industry and other consumer electronic products, in particular to a three-axis capacitive MEMS acceleration sensor And preparation method. Its technical solution detects three-axis acceleration. Background technique [0002] MEMS is the essence of future weapons and the supporting technology and key technology in future military weapons and equipment. Foreign countries have taken the lead in applying MEMS sensors to missiles and missile launch systems and intelligent weapon systems. The US Department of Defense Advanced Research Projects Agency (DARPA) has recognized MEMS technology as an emerging technology that the United States urgently needs to develop, and is focusing on promoting MEMS sensor research projects. [0003] MEMS inertial devices ca...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/125G01P15/18B81B3/00B81C1/00
Inventor 许高斌陈兴马渊明
Owner NANJING ZHONGNUOSITE SENSOR SCI & TECH