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an electronic device

An electronic device and an integrated technology, applied in the direction of electrical equipment shells/cabinets/drawers, electrical components, etc., can solve the problems of signal shielding, high requirements, high industrial production costs, etc., to ensure communication quality, prevent signal shielding, and reduce costs Effect

Active Publication Date: 2018-07-06
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, carbon fiber is a natural conductor, and as the main material of the casing, it will cause signal shielding, making the receiver of the wireless signal unable to work normally
Although the embedded injection molding process can be used to solve the signal shielding problem of the carbon fiber shell, this process has high requirements on the mold technology, and the production of the mold needs to be very fine, so the industrial production cost is relatively high

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] figure 1 It is a schematic cross-sectional view of the housing of the electronic device according to the embodiment of the present invention Figure 1 , the electronic device can be a notebook computer, a tablet computer, a mobile phone, etc.; such as figure 1 As shown, the housing includes more than one layer of material layers, and the more than one layer of material layers is arranged in a first form, and the first form is a form of upper and lower layers; the arrangement in the first form More than one material layer is connected and formed as a whole through a first processing process, and the first processing process may be a thermocompression forming process.

[0024] The material layers in the more than one material layer include more than one material, and the prepregs of the more than one material are superimposed according to the preset lay-up plan, and after the superposition is completed, the entire board is formed by a hot pressing forming process .

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Embodiment 2

[0028] figure 2 It is a schematic cross-sectional view of the housing of the electronic device according to the embodiment of the present invention Figure II , the electronic device can be a notebook computer, a tablet computer, a mobile phone, etc.; such as figure 2 As shown, the housing includes more than one layer of material layers, and the more than one layer of material layers is arranged in a first form, and the first form is a form of upper and lower layers; the arrangement in the first form More than one material layer is connected and formed as a whole through a first processing process, and the first processing process may be a thermocompression forming process.

[0029] The material layer in the more than one material layer includes more than one material, wherein the more than one material includes at least the first material and also includes the second material; the first material layer in the more than one material layer The materials are all arranged on o...

Embodiment 3

[0035] Figure 5 It is a schematic cross-sectional view of the housing of the electronic device according to the embodiment of the present invention Figure five , the electronic device can be a notebook computer, a tablet computer, a mobile phone, etc.; such as Figure 5 As shown, the housing includes more than one layer of material layers, and the more than one layer of material layers is arranged in a first form, and the first form is a form of upper and lower layers; the arrangement in the first form More than one material layer is connected and formed as a whole through a first processing process, and the first processing process may be a thermocompression forming process.

[0036] The material layer in the more than one material layer includes more than one material, wherein the more than one material includes at least the first material and also includes the second material; the first material layer in the more than one material layer The materials are all arranged on...

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Abstract

The embodiment of the present invention discloses an electronic device. The electronic device includes a casing, and the casing includes more than one material layer arranged in a first form. Formally arranged more than one layer of material layers are connected and formed as a whole; the material layers in the above one layer of material layers include more than one material; the more than one material includes at least the first material; wherein, the The first material in the above one or more material layers is arranged continuously; the first material is insulating. Adopting the technical solution of the embodiment of the present invention effectively avoids the signal shielding caused by the housing of the electronic equipment being entirely made of conductive materials, ensures the communication quality of the electronic equipment, and reduces the cost of industrial production.

Description

technical field [0001] The present invention relates to terminal equipment, in particular to an electronic equipment. Background technique [0002] At present, portable electronic devices have higher and higher requirements for lightweight, and carbon fiber materials have the characteristics of high strength and low density, and are also increasingly applied to electronic devices. However, carbon fiber is a natural conductor, and as the main material of the casing, it will cause signal shielding, making the receiver of the wireless signal unable to work normally. Although the embedded injection molding process can be used to solve the signal shielding problem of the carbon fiber shell, this process has high requirements on the mold technology, and the production of the mold needs to be very fine, so the industrial production cost is relatively high. Contents of the invention [0003] In order to solve the existing technical problems, an embodiment of the present invention...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/00
Inventor 郝宁尤德涛
Owner LENOVO (BEIJING) LTD