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Display substrate, display substrate manufacturing method and display device

A technology for display substrates and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, optics, instruments, etc., can solve the problems of rising cost of display device products, and achieve the effects of reducing production costs and simplifying production steps

Active Publication Date: 2015-06-24
HEFEI BOE OPTOELECTRONICS TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Excessive number of patterning processes will directly lead to an increase in the cost of display device products, so how to further reduce the number of patterning processes has become an issue of increasing concern

Method used

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  • Display substrate, display substrate manufacturing method and display device
  • Display substrate, display substrate manufacturing method and display device
  • Display substrate, display substrate manufacturing method and display device

Examples

Experimental program
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Embodiment Construction

[0044] It should be noted:

[0045] 1. The "upper" in "X is arranged on Y" or "X is arranged on Y" in the present invention includes the meaning that X is in contact with Y and that X is located above Y. In the present invention, as attached As shown in the figure, the substrate is defined as being set at the bottom;

[0046] 2. The patterning process referred to in the present invention includes processes such as photoresist coating, masking, exposure, development, etching, photoresist stripping, and the photoresist is an example of a positive photoresist;

[0047] 3. The "so-and-so region" mentioned in the present invention is the region where a certain pattern is mapped on the substrate, that is, the region has the same shape as the certain pattern, such as the grid line area, which is the pattern of the grid line on the substrate The mapped area can also be understood as the area on the substrate where the grid pattern will be set.

[0048] The following will clearly and...

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PUM

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Abstract

An embodiment of the invention relates to the technical field of display and provides a display substrate, a display substrate manufacturing method and a display device. The method includes a step of formation of an etched barrier layer pattern and a first electrode pattern on the substrate. The step of formation of the etched barrier layer pattern and the first electrode pattern on the substrate includes: sequentially forming an etched barrier layer film and a first electrode film to further form the etched barrier layer pattern and the first electrode pattern by means of one-time composition. The display substrate is applicable to manufacturing of display devices. By the display substrate, the display substrate manufacturing method and the display device, a composition process of single formation of the etched barrier layer pattern is saved, and accordingly technical process is simplified, and manufacturing cost is reduced.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] With the continuous development of TFT-LCD (Thin Film Transistor Liquid Crystal Display, Thin Film Transistor Liquid Crystal Display) display technology, more and more new technologies are constantly being proposed and applied. TFT-LCD based on ADS (Advanced Super Dimension Switch, AD-SDS, referred to as ADS, Advanced Super Dimension Field Switching Technology) mode has attracted more and more people's attention due to its low power consumption, wide viewing angle and other characteristics. [0003] ADS technology mainly forms a multi-dimensional electric field through the electric field generated by the edge of the slit electrode in the same plane and the electric field generated between the slit electrode layer and the plate electrode layer, so that all aligned liqu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/77H01L27/12G02F1/1362G02F1/1368
Inventor 段献学白明基徐德智邹志翔
Owner HEFEI BOE OPTOELECTRONICS TECH