Cooling system of cabinet

Abstract

A cooling system of a cabinet comprises an outer circulating system and an inner circulating system. The outer circulating system comprises a cold source, a liquid storage tank and an outer circulating pump, and a working medium inlet pipe and a working medium outlet pipe of the outer circulating system are connected with a middle heat exchanger. The inner circulating system comprises a cabinet inner circulating sub-system, a working medium inlet pipe of the inner circulating system and a working medium outlet pipe of the inner circulating system. The cabinet inner circulating sub-system comprises liquid-cooling radiators, a cabinet inner work medium inlet connected with the working medium inlet pipe of the inner circulating system through an inlet check valve, a cabinet inner working medium return pipe connected with a working medium return pipe of the inner circulating system through an outlet check valve, and an air-cooling radiator. The air-cooling radiator is connected with the cabinet inner working medium inlet pipe and the cabinet inner working medium return pipe, a flow proportion adjusting valve is arranged between the air-cooling radiator and the cabinet inner working medium inlet pipe, the liquid-cooling radiators are connected with the cabinet inner working medium inlet pipe and the cabinet inner working medium return pipe, and a flow proportion adjusting valve is arranged between each liquid-cooling radiator and the cabinet inner working medium inlet pipe. The cooling system has the advantages of being high in cooling efficiency and capable of saving energy.

Description

technical field [0001] The invention relates to the technical field of heat dissipation and cooling, and more specifically, to a heat dissipation system for a server cabinet. Background technique [0002] In the communication and IT industry, a large number of standard cabinets are used to provide a physical installation environment for internal servers, switches, storage devices and other electronic devices. In order to provide heat dissipation for the equipment inside the cabinet, a large number of fans are used to take the heat inside the cabinet out of the cabinet, and then transfer the heat to the external environment through equipment such as air conditioners or fans in the room. As the heat consumption of electronic chips and power devices increases, the heat generated inside the cabinet continues to increase, and the air-cooled heat dissipation method can no longer meet the heat dissipation requirements of the internal equipment. [0003] In order to enhance the hea...

AI Technical Summary

Problems solved by technology

[0007] The aforementioned cooling systems are roughly divided into two types: air-cooled cooling and liquid-cooled cooling. When the pipeline outside the cabinet fails or is abnormal, all the cold plates in the cabinet will stop working, which will easily cause the temperature in the cabinet and the device temperature to rise rapidly, causing losses, and the flow of the pipeline inside the cabinet cannot be adjusted

Moreover, in actual use, there are not only devices with low heat generation density that can be solved by air cooling in the cabinet, but also devices with high heat generation density that need to be cooled by water cooling. The heat dissipation scheme needs to independently set up water-cooled or air-cooled external heat dissipation methods to ensure the normal operation of the entire cabinet

Most of the air-cooled side adopts multi-unit backup to provide emergency heat dissipation in case of failure, while in the liquid-cooled mode, the failure of the main cooling pipe will often cause a large area of ​​thermal protection shutdown of the cabinet, resulting in huge losses

Images