Apparatus for irradiating light
A technology of light irradiation and equipment, applied in the direction of laser welding equipment, welding equipment, welding equipment, etc., can solve the problems of unevenness, thermal deformation, temperature rise of the collector 50, etc.
Active Publication Date: 2015-07-01
AP SYST INC +1
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Problems solved by technology
Since the temperature of the transmission window 40 increases continuously due to the repeated incident of reflected light into the transmission window 40, the transmission window 40 may have an uneven temperature.
Therefore, when the laser light is transmitted through the transmission window 40 and then irradiated onto the substrate 1 to perform the crystallization process, unevenness (Mura) may be generated.
[0005] Also, since the laser light is repeatedly absorbed into the collector 50, the temperature of the collector 50 may rise
Therefore, the peripheral portion of the collector 50 may be heated and may be thermally deformed.
This may be a factor that displaces the laser beam irradiated on the substrate 1
Method used
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[0038] Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
[0039] figure 1 is a cross-sectional view of the substrate processing apparatus according to the embodiment, figure 2 is a three-dimensional cutaway view of the light irradiation module of the substrate processing apparatus according to the embodiment when viewed from the front, image 3 is a front sectional view of the substrate processing apparatus according to the embodiment, Figure 4 is a three-dimensional view of the first and second collectors according to an embodiment when viewed from above, Figure 5 is along Figure 4 The cross-sectional view o...
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The present invention relates to an apparatus for irradiating light. The apparatus includes: a first collector which is inclined upwards in the outer direction of a penetration window, is installed on top of the penetration window, and firstly offsets light reflected from the board and penetrated the penetration window; and a second collector which is located between the first collector and the penetration window, is installed on the outside from the central axis of the penetration window compared to the first collector, and secondly offsets and removes the reflected light firstly offset by the first collector so as to dissipate reflected light of secondary offset. Accordingly, diffused reflection of the light reflected from the board is inhibited or minimized. The first collector can guide the reflected light to face in the outer direction of the penetration window so as to prevent the reflected light from being re-reflected to the penetration window.
Description
technical field [0001] The present invention relates to a light irradiation device, and more particularly, to a light irradiation device capable of suppressing a temperature rise of a transmission window due to an imbalance in the temperature of the transmission window due to light reflected from a substrate. Background technique [0002] In the manufacture of liquid crystal displays and photovoltaic devices, heat treatment processes for crystallizing amorphous polycrystalline thin films (eg, amorphous polycrystalline silicon thin films) are involved. Here, if glass is used as the substrate, the amorphous polycrystalline thin film can be crystallized by using laser light. However, when the amorphous polycrystalline film is mixed with oxygen (O 2 ) reaction, the amorphous polycrystalline film may be oxidized to produce an oxide film and also be polluted by impurities or cause property changes. [0003] A laser substrate processing apparatus according to the prior art includ...
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Login to View More IPC IPC(8): B23K26/50
CPCB23K26/50B23K26/009B23K37/003B23K26/064B23K26/703
Inventor 梁相熙李基雄金圣进
Owner AP SYST INC