Cooling device and plasma processing equipment

Abstract

The invention relates to a cooling device and a piece of plasma processing equipment. The cooling device comprises a spraying device and a water tank. A side, directly facing a piece of corresponding equipment, of a reaction chamber is provided with a first opening used for communicating the reaction chamber with the corresponding equipment. The side wall of a side, the same as the first opening, of the water tank is provided with a second opening. The side, where the second opening is disposed, of the water tank is provided with a groove which surrounds the second opening along the two sides and the lower part of the second opening. A sealing ring matched with the groove is arranged in the groove, and a sealing space is formed between the sealing ring and the groove. The cooling device further comprises a gas source and a vacuum pumping device, both of which are communicated with the sealing space. The gas source is used for inputting gas into the sealing space when the cooling device is working so as to make the sealing ring partially extend out of the groove under the pressure of gas and make the sealing ring in close contact with the corresponding equipment. The vacuum pumping device is used for vacuum-pumping the sealing space when the cooling device is disassembled so as to enable the part of the sealing ring extending out of the groove retract into the groove.

Description

technical field [0001] The invention relates to the technical field of microelectronic processing, in particular to a cooling device and plasma processing equipment. Background technique [0002] figure 1 A schematic diagram of the plasma processing equipment. like figure 1 As shown, the plasma processing equipment includes a reaction chamber 1, a transmission chamber 6, an exhaust gas treatment system 7 and a heating coil 3; wherein, the two sides of the reaction chamber 1 have lateral openings, which are respectively used for connecting with the transmission chamber 6, the The tail gas treatment system 7 is sealed and connected so that the manipulator located inside the transfer chamber 6 transmits the processed workpiece to the inside of the reaction chamber 1, and the gas in the reaction chamber 1 is discharged from the tail gas treatment system 7; the heating coil 3 is used for The tray in the reaction chamber 1 is heated to make it have a higher temperature and make...

AI Technical Summary

Problems solved by technology

[0007] First of all, in the above process, since the distance between the reaction chamber 1 and the transfer chamber 6 and the tail gas treatment system 7 is fixed, there is a tight seal between the reaction chamber 1 and the transfer chamber 6 and the tail gas treatment system 7. When the sealing ring 4 is subjected to the pressure of the tail gas treatment system 7 toward the reaction chamber 1 and the pressure of the reaction chamber 1 to the transfer chamber 6, the pressure is constant. In this case, the driving device 5 applies a When the force is greater, the pressure on the sealing ring 4 will not increase accordingly, which makes the contact between the sealing ring 4 and the transmission chamber 6 and the exhaust gas treatment system 7 not tight under certain circumstances, and its sealing effect poor, resulting in easy leakage of cooling water from the joint between the sealing ring 4 and the transmission chamber 6 and the exhaust gas treatment system 7

[0008] Secondly, in the plasma processing equipment, the reaction chamber 1 needs to be maintained frequently, and the water tank 2 needs to be disassembled during the maintenance process. The small distance or direct contact between them will cause friction between the sealing ring 4 and the transmission chamber 6 and the exhaust gas treatment system 7, and even cause the sealing ring 4 to be scratched, which makes the sealing ring 4 often need to be replaced in actual use. replacement, thereby increasing the maintenance cost of the reaction chamber 1

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