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Flexible printed circuit board and its manufacturing method

A technology of flexible circuit boards and flexible circuit substrates, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve problems such as the number of layers and the thickness of flexible circuit boards that cannot adapt to the development trend of circuit boards, and achieve thin stacking Effect

Active Publication Date: 2018-01-30
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

At present, the number of stacked layers of flexible circuit boards with electromagnetic shielding effect produced by this method is too many, and the thickness of flexible circuit boards cannot adapt to the current development trend of thinner and thinner circuit boards.

Method used

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  • Flexible printed circuit board and its manufacturing method
  • Flexible printed circuit board and its manufacturing method
  • Flexible printed circuit board and its manufacturing method

Examples

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Effect test

Embodiment Construction

[0018] The embodiment of the present invention provides a method for manufacturing a double-sided flexible circuit board with a shielding effect, including the steps:

[0019] The first step, see figure 1 , Provide a flexible circuit substrate 100.

[0020] The flexible circuit substrate 100 includes a base layer 110 and a first copper foil layer 111 and a second copper foil layer 112 formed on both sides of the base layer 110. The flexible circuit substrate 100 further includes at least one via 114, and the via 114 sequentially penetrates the first copper foil layer 111, the base layer 110 and the second copper foil layer 112. The base layer 110 may be a flexible resin layer, such as Polyimide (PI), Polyethylene Terephthalate (PET) or Polythylene Naphthalate (Polythylene Naphthalate, PEN), it can also be a multilayer substrate.

[0021] In this embodiment, at least one through hole is opened on the base layer 110, and then the first copper foil layer 111 and the second copper foil...

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PUM

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Abstract

A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.

Description

Technical field [0001] The invention relates to a flexible circuit board, in particular to a flexible circuit board with an electromagnetic shielding structure and a manufacturing method thereof. Background technique [0002] As the conductive lines in the flexible circuit board become more and more dense, the conductive circuit will generate a large amount of electromagnetic fields and affect other electronic devices; in addition, the electromagnetic radiation generated by other electronic devices may also affect the flexible circuit board, resulting in spurious signals The interference caused by electronic products brings disadvantages to the use of electronic products. Therefore, electromagnetic shielding structures are usually designed on flexible circuit boards. A common practice is to paste conductive cloth on the entire surface of the flexible circuit board or the covering layer corresponding to the dense circuit area after the flexible circuit board is manufactured. The ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0218H05K1/0219H05K1/0393H05K2201/0715H05K2201/09509Y10T156/1057
Inventor 何明展胡先钦沈芾云庄毅强
Owner AVARY HLDG (SHENZHEN) CO LTD
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