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Semiconductor package and method for producing a semiconductor package

A packaging and semiconductor technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., which can solve the problems of insufficient heat, sending off chips, etc.

Active Publication Date: 2015-08-05
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The usual thermal conductivity of the previously mentioned encapsulants may not be sufficient to transport heat away from the chip

Method used

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  • Semiconductor package and method for producing a semiconductor package
  • Semiconductor package and method for producing a semiconductor package
  • Semiconductor package and method for producing a semiconductor package

Examples

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Embodiment Construction

[0019] In the following, examples are described with reference to the drawings, wherein like reference numerals are generally used to refer to like elements throughout. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more aspects of the examples. It will be apparent, however, to one skilled in the art that one or more aspects of the examples may be practiced with a lesser degree of these specific details. The following description should therefore not be read in a limiting sense, and the scope of protection is defined by the appended claims.

[0020] The aspects outlined can be embodied in a variety of forms. The following description shows by way of illustration various combinations and configurations in which this aspect can be practiced. It is understood that the described aspects and / or examples are merely examples and that other aspects and / or examples may be utiliz...

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Abstract

A device includes a die and at least one of an encapsulant at least partly encapsulating the die and a carrier to which the die is attached. The at least one of the encapsulant and the carrier includes a thermoplastic polymer that includes metallic particles.

Description

technical field [0001] The present disclosure relates to semiconductor packages. The present disclosure also relates to methods for producing semiconductor packages. Background technique [0002] Semiconductor packages may be configured to protect the die from physical damage. Additionally, the semiconductor package can protect the die from environmental influences such as humidity or chemical environments. A semiconductor package may be produced by mounting the die onto a carrier or lead frame, and molding an encapsulant material around the mounted die. The thermal conductivity of the encapsulant used for the semiconductor package may be less than or equal to about 10 W / (m*K). [0003] In operation, the die can generate heat that should be dissipated to ensure the reliability of the die. Especially for new chip technologies, such as gallium nitride (GaN) based dies, the problem of die heating itself can limit its performance in power applications. Device heating can th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29H01L21/56
CPCH01L23/3107H01L21/565H01L23/295H01L23/49541H01L23/4334H01L23/49838H01L2224/73253H01L2924/0002H01L23/13H01L23/3737H01L23/3121H01L21/568H01L2224/96H01L2924/00
Inventor J·马勒
Owner INFINEON TECH AG