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Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer

A layered structure and metallization technology, which is applied in the field of metal layers, can solve the problems of predicting the exact position of bumps, predicting surface topography, and not being able to predict costs, etc.

Inactive Publication Date: 2015-08-12
LPKF LASER & ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Precise surface topography cannot be predicted or cannot be predicted at reasonable cost with existing knowledge prior to laser exposure
In particular the exact position of the bumps (Erhebung) or valleys (Tales) cannot be predicted or predicted at reasonable cost at present

Method used

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  • Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer
  • Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer
  • Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer

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Embodiment Construction

[0066] To facilitate understanding, Figure 1 to 3 The process flow of introducing microstructures on the substrate by etching according to the prior art is shown. It can be seen that the components contained in the workpiece (shown in the side section) by means of the etching method are digested by the ablation of the workpiece surface, and then chemically eluted from the workpiece. This creates a cavity required according to the prior art, which extends from the surface of the workpiece into a deeper layer, as in figure 2 As identified in. So these cavities are very suitable for forming image 3 The undercut of the metal layer shown is thus adhesively connected to the workpiece.

[0067] in contrast, Figure 4 The different shapes of the microstructure manufactured according to the invention and the metal layer applied to it are shown in the schematic diagram. It can be seen that the microstructure has a tapered shape facing the metal layer, which can be realized by a cone or...

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Abstract

The invention relates to a method for the metallation of a workpiece surface. The workpiece surface is provided, in the regions to be metallized, with periodic microstructures (6) that are preferably transfered to the workpiece surface by forming or molding a tool (2) microstructured by means of laser radiation (5). Then at least the microstructured regions of the workpiece surface are metallized in an adhesive manner in order to produce the layer structure.

Description

Technical field [0001] The present invention clearly relates to a method of at least partially adhesively metalizing non-conductive workpieces (Werkstück). Furthermore, the invention relates to a workpiece comprising a layered structure and an adhesive metal layer connected to it by structuring. Background technique [0002] Since the first realization of the adhesive wet chemical method (haftfest nasschemisch) metallization injection molding (spritzgegossen) plastic parts made of ABS (acrylonitrile-butadiene-styrene) in the 1960s, it has always existed Extensive process research and development, as well as surface finishing for functionality and / or decoration The purpose is to metalize other engineering plastics in an adhesive manner, such as polyamide (PA), polybutylene terephthalate (PBT) or polycarbonate (PC) with continuous use temperature (Dauergebrauchs temperaturen) up to 150°C and Thermodynamically more reliable high-performance plastics, such as polyetherimide (PI), p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/00C25D5/02C23C18/16C23C18/20H05K3/18C23C18/18C23C18/30
CPCH05K2203/0113C23C18/30H05K3/182C23C18/165C25D5/02C23C18/1608C23C18/2013H05K3/381H05K3/0014C23C18/208C23C18/204C23C18/1841C25D5/00H05K2201/2072C23C18/00C23C18/38B44F3/00C23C18/31H05K1/0296H05K3/181
Inventor R.奥斯特霍尔特R.A.克鲁格B.罗斯纳E.豪曼
Owner LPKF LASER & ELECTRONICS
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