Chip suction device for high-precision testing

Abstract

The invention discloses a material suction device for high-precision detection of chips. The material suction device is connected just above a detection platform, realizes single and automatic moving of chips, and comprises a plurality of supporting arms and air suction devices. The plurality of supporting arms are connected above the detection platform; each air suction device is sleeved in the corresponding supporting arm; each air suction device comprises a suction nozzle, a cylinder, a piston and an air pipe; each suction nozzle is connected at the bottom part of the corresponding cylinder and arranged just above the detection platform; each supporting arm sleeves the corresponding cylinder for fixation; each piston is sleeved in the corresponding cylinder and slides up and down; one end of each air pipe is connected with the corresponding piston, and the other end is connected with an air extracting pump; and the air extracting pump drives the pistons to move up and down. The material suction device disclosed by the invention is connected just above the detection platform, the air extracting pump is adopted to drive the air suction devices to adsorb the chips which are placed on the chip detection platform on the suction nozzles, thus the chips can be moved one by one through moving the material suction device, and the automatic detection degree of the material suction device is improved.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to a suction device for high-precision detection of chips. Background technique [0002] The complete process of chip production includes several links such as chip design, wafer production, packaging production, and cost testing, among which the wafer production process is particularly complicated. [0003] The first is the chip design. According to the design requirements, the generated "pattern" is followed by the production of the wafer: the raw material wafer of the chip is selected, and then some pure silicon is made into a silicon crystal rod, which becomes the quartz semiconductor material for manufacturing integrated circuits. , Slicing it is the wafer specifically needed for chip making. The thinner the wafer, the lower the cost of production, but the higher the requirements for the process, and then the wafer coating film to improve its resistance to oxidation...

AI Technical Summary

Problems solved by technology

The existing chip detection does not sort the chips, but directly detects them. Due to the different orientations of the chips, it will cause errors in the infrared detection of the chips, and requires a second rework for detection.

And manual confirmation is required, the degree of automation is not high, and the labor cost is relatively high

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