Chip suction device for high-precision testing
A suction device and high-precision technology, which is applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve the problems of low automation, high labor cost, and chip infrared detection error, etc., to achieve convenient and separate detection , Improving the detection efficiency and the degree of automatic detection and the effect of detection efficiency
Active Publication Date: 2018-05-04
兴化市华宇电子有限公司
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Problems solved by technology
The existing chip detection does not sort the chips, but directly detects them. Due to the different orientations of the chips, it will cause errors in the infrared detection of the chips, and requires a second rework for detection.
And manual confirmation is required, the degree of automation is not high, and the labor cost is relatively high
Method used
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Embodiment Construction
[0014] In order to deepen the understanding of the present invention, the present invention will be further described below in conjunction with the accompanying drawings and embodiments, which are only used to explain the present invention and do not limit the protection scope of the present invention.
[0015] Such as figure 1 and figure 2 As shown, the suction device for high-precision chip detection is connected directly above the detection platform 1 to realize a single automatic movement of the chip, including several support arms 2 connected above the detection platform 1, and each support arm The suction device 3 in 2; each suction device 3 includes a suction nozzle 4, a cylinder 5, a piston 6, and an air pipe 7 arranged from bottom to top. Right above, each support arm 2 is set on the outside of its corresponding cylinder 5 to fix it, the piston 6 slides up and down in the cylinder 5, one end of the air pipe 7 is connected to the piston 6, and the other end is connec...
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The invention discloses a material suction device for high-precision detection of chips. The material suction device is connected just above a detection platform, realizes single and automatic moving of chips, and comprises a plurality of supporting arms and air suction devices. The plurality of supporting arms are connected above the detection platform; each air suction device is sleeved in the corresponding supporting arm; each air suction device comprises a suction nozzle, a cylinder, a piston and an air pipe; each suction nozzle is connected at the bottom part of the corresponding cylinder and arranged just above the detection platform; each supporting arm sleeves the corresponding cylinder for fixation; each piston is sleeved in the corresponding cylinder and slides up and down; one end of each air pipe is connected with the corresponding piston, and the other end is connected with an air extracting pump; and the air extracting pump drives the pistons to move up and down. The material suction device disclosed by the invention is connected just above the detection platform, the air extracting pump is adopted to drive the air suction devices to adsorb the chips which are placed on the chip detection platform on the suction nozzles, thus the chips can be moved one by one through moving the material suction device, and the automatic detection degree of the material suction device is improved.
Description
technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to a suction device for high-precision detection of chips. Background technique [0002] The complete process of chip production includes several links such as chip design, wafer production, packaging production, and cost testing, among which the wafer production process is particularly complicated. [0003] The first is the chip design. According to the design requirements, the generated "pattern" is followed by the production of the wafer: the raw material wafer of the chip is selected, and then some pure silicon is made into a silicon crystal rod, which becomes the quartz semiconductor material for manufacturing integrated circuits. , Slicing it is the wafer specifically needed for chip making. The thinner the wafer, the lower the cost of production, but the higher the requirements for the process, and then the wafer coating film to improve its resistance to oxidation...
Claims
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IPC IPC(8): H01L21/66
CPCH01L22/14
Inventor 易申钱宝龙
Owner 兴化市华宇电子有限公司