A method of manufacturing a PCB with dense cooling holes
A production method and technology of heat dissipation holes, which are applied in circuit thermal devices, multilayer circuit manufacturing, printed circuit manufacturing, etc., can solve the problems of dense heat dissipation hole delamination, explosion board and other problems, so as to reduce the damage between resins and prevent the hole wall copper Fracture and bursting and delamination, the effect of increasing the bonding force
Active Publication Date: 2018-07-06
JIANGMEN SUNTAK CIRCUIT TECH
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Problems solved by technology
[0003] The present invention aims at the problem that the PCB with dense heat dissipation holes produced in the prior art is prone to delamination and explosion of dense heat dissipation holes during reflow soldering, and provides a method for manufacturing a PCB with dense heat dissipation holes with good heat resistance. The prepared PCB can withstand the high temperature of reflow soldering, preventing the problems of copper fracture, explosion and delamination of the hole wall of dense heat dissipation holes.
Method used
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Embodiment
[0024] refer to Figure 1-2 , the present embodiment provides a method for manufacturing a PCB with dense heat dissipation holes, and the specific manufacturing steps are as follows:
[0025] (1) Select a base material with a glass transition temperature (Tg) of 170°C, and select the expansion coefficient of the Z direction (vertical direction) of the base material: the thermal expansion coefficient below the glass transition temperature is 45ppm / °C, and the glass state The coefficient of thermal expansion above the transition temperature is 220 ppm / °C.
[0026] According to the circuit board production process in the prior art, the base material is cut to obtain the base board for preparing each inner layer board. After the conventional pretreatment of the substrate, the inner layer circuit pattern is made on the substrate through the steps of applying wet film on the substrate, exposing, developing, etching, and stripping the film (negative film process), thereby making eac...
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The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a PCB with dense cooling holes. The present invention can increase the bonding force between the inner layer board and the prepreg and the bonding force between the hole wall copper of the dense cooling holes and the base material by arranging the copper ring on the inner layer board. Adding the process of baking the inner layer board after browning can prevent the moisture in the inner layer board from attacking the prepreg during the pressing process, thereby improving the bonding force between the board layers. Drill dense holes by jumping drilling, and use a feed rate of 20mm / min, so that the same dense hole will not be subject to continuous cutting vibration and pulling, and reduce the resin damage caused by continuous drilling in the dense hole area. , to avoid glass cloth cracks. The PCB prepared by the present invention has strong bonding force between board layers and strong bonding force between the hole wall copper of the dense heat dissipation holes and the base material, which can withstand the high temperature of reflow soldering and prevent the occurrence of dense heat dissipation holes. and stratification issues.
Description
technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a PCB with dense cooling holes. Background technique [0002] PCB (Printed Circuit Board) is one of the important components of the electronics industry, a support for electronic components, and a carrier for electrical connections. With the continuous update of electronic product application technology and the improvement of functions, the design of PCB is becoming more and more precise, dense and high-performance, so the heat dissipation performance requirements of the board are also getting higher and higher, so a large number of dense heat dissipation holes Designed for use on PCBs. Dense heat dissipation holes refer to metallized through holes with a distance between two adjacent holes of 0.4-1.0mm (the distance between the walls of the two holes), and its effect is equivalent to a thin copper conduit penetrating along the thic...
Claims
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IPC IPC(8): H05K1/02H05K3/46
CPCH05K1/0201H05K3/4611H05K2203/0221
Inventor 敖四超戴勇白会斌汪广明
Owner JIANGMEN SUNTAK CIRCUIT TECH