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cutting device

A cutting device and cutting edge technology, which is applied in the direction of automatic grinding control devices, grinding machine parts, grinding/polishing equipment, etc., can solve the problems that it is not suitable for detection of small abnormalities, and it is impossible to properly detect the damage of cutting tools

Active Publication Date: 2019-07-30
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, in the above-mentioned method using an optical sensor, there is a problem that abnormalities other than breakage of the cutting tool cannot be properly detected
On the other hand, the current monitoring method can detect various abnormalities that affect the rotation of the cutting tool, but there is a certain degree of measurement error, so it is not suitable for the detection of minute abnormalities

Method used

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Embodiment Construction

[0074] Embodiments of the present invention will be described with reference to the drawings. figure 1 It is a perspective view schematically showing a configuration example of the cutting device of the present embodiment. Such as figure 1 As shown, the cutting device 2 is provided with a base 4 supporting each structure.

[0075] On the upper surface of the base 4, a rectangular opening 4a long in the X-axis direction (front-rear direction, machining feed direction) is formed. An X-axis moving table 6, an X-axis moving mechanism (not shown) for moving the X-axis moving table 6 in the X-axis direction, and a waterproof cover 8 covering the X-axis moving mechanism are provided in the opening 4a.

[0076] The X-axis moving mechanism includes a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and the X-axis moving table 6 is slidably provided on the X-axis guide rails. A nut portion (not shown) is fixed to the lower surface side of the X-axis movable ta...

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Abstract

The present invention provides a cutting device capable of appropriately detecting abnormalities during cutting. The cutting device includes: a vibration signal generating member (68) that generates a vibration signal corresponding to the vibration of the cutting tool (60); and a control member (78) that determines cutting based on the vibration signal generated by the vibration signal generating member. The status of the cutting tool, the vibration signal generating member is composed of the following parts: an ultrasonic vibrator (70), which is arranged on the first flange member (46) and generates a voltage corresponding to a vibration signal corresponding to the vibration of the cutting tool; and a transmission A member (72) is connected to the ultrasonic vibrator and transmits voltage to the control member. A plurality of ultrasonic waves having different resonant frequencies connected in parallel with the first coil member (74) constituting the transmission member are arranged on the first flange member. Oscillators (70a, 70b, 70c).

Description

technical field [0001] The present invention relates to a cutting device for cutting a plate-shaped workpiece. Background technique [0002] For example, a plate-shaped workpiece represented by a semiconductor wafer is cut and divided into a plurality of chips by a cutting device provided with an annular cutting blade. During the cutting of the workpiece, the cutting tool vibrates when abnormalities such as breakage of the cutting tool, reduction in cutting performance, contact with foreign matter, or change in machining load occur. [0003] Therefore, in order to detect such an abnormality, various methods have been studied. For example, breakage of a cutting tool can be detected by a method using an optical sensor (for example, refer to Patent Document 1). Furthermore, a change in the machining load can also be detected by a method of monitoring the current of the spindle (motor) to which the cutting tool is attached. [0004] Patent Document 1: Japanese Patent No. 4704...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B27/06B24B49/00B24B51/00H01L21/67
CPCH01L21/67092B24B27/06B24B49/00B24B51/00
Inventor 久保雅裕中西优尔和泉邦治
Owner DISCO CORP
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