Electronic equipment

Abstract

The present invention provides an electronic device capable of improving water resistance even under repeated thermal cycle environments. An electronic device includes: a cylindrical case; a front end part accommodated in one end of the cylindrical case and blocking the one end; a circuit board fixed on the front part; a flexible wire having a core wire and covering the core. a covering material of a wire, the core wire is exposed from one end of the covering material; an inner case accommodated in the cylindrical case, the inner case is cylindrical and has one end in contact with the front end part for The circuit board is accommodated, and the resin part covers the part where the front part and the inner case are in contact with water, the core wire is connected to the circuit board, and the flexible wire passes through the other part of the inner case. One end protrudes from the other end of the cylindrical casing to the outside of the cylindrical casing, and the inner shell and the covering material are welded around the entire circumference of the covering material.

Description

technical field [0001] The present invention relates to an electronic device, and more particularly, to an electronic device having a structure in which a circuit board is accommodated in a casing. Background technique [0002] Among conventional electronic devices, there is an electronic device in which the filling resin in the housing shrinks and expands as the temperature changes. As a result, stress acts on the circuit board in the housing. The purpose of electronic equipment (for example, refer to Patent Document 1). [0003] In the proximity sensor of electronic equipment disclosed as Patent Document 1, in the proximity sensor filled with an insulating resin, a circuit substrate is stored in a protective cover. After the circuit board is stored in the protective cover, insulating resin is injected from the gap between the flanged cover and the case, so that stress due to shrinkage / expansion of the resin does not act on the circuit board inside the case. [0004] Pate...

AI Technical Summary

Problems solved by technology

However, even with such a structure, there is a problem that the sealing between the main body case and the cord connected to the circuit board accommodated inside is only the adhesion with the filling resin, and it is difficult to maintain the temperature after repeated thermal cycles. In the environment, the water resistance will be lowered due to the peeling of the part due to the expansion / shrinkage of the filling resin, water entering from the gap between the cord and the resin, etc.

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