Circulation pipeline of activation cylinder of gold immersion process for printed circuit board

Abstract

The invention discloses a circulation pipeline of an activation cylinder of a gold immersion process for a printed circuit board. The circulation pipeline comprises a circulation pump arranged on one side of an activation cylinder, an activation pump water-in pipe arranged on the same side as the circulation pump, an activation pump water-out pipe opposite to the activation pump water-in pipe and a cooling water pipe disc arranged at the bottom in the activation cylinder, wherein the part of the activation pump water-out pipe in the activation cylinder comprises a vertical pipe and multiple horizontal pipes communicated with each other; the connection part of the horizontal pipes is oblique to the horizontal direction; the vertical pipe is communicated with the connection part; and multiple holes are formed in the horizontal pipe. Since multiple holes are formed in the horizontal pipe, activation medicine liquid can be uniformly sprayed to each part in the activation cylinder through the holes in the horizontal pipe, thus the circuit board is uniformly activated, the phenomena of skip plating and gold leakage are avoided, the scrap rate caused by skip plating and gold immersion is reduced by 50% or more, and the production cost is remarkably reduced; and moreover, since the activation medicine liquid sprayed out of the holes is uniformly distributed in the activation cylinder, the concentration of the medicine liquid in each part in the cylinder is uniform, and the activation effect is enhanced.

Description

technical field [0001] The invention belongs to the field of circuit board processing, and in particular relates to a circulation pipeline of an activation cylinder in the immersion gold process of a printed circuit board. Background technique [0002] At present, in the production process of printed circuit boards, it is usually necessary to deposit nickel and gold on the base copper to make the surface of printed circuit boards stable in color, good in brightness, flat in coating and good in solderability. Since copper is located behind nickel in the electroplating process, the copper surface must be activated for electroless nickel plating. Uneven activation during the activation process will directly affect the quality of the circuit board product. In the prior art, the activation cylinder used in the activation process includes a circulation pump, an activation liquid inlet connected to the circulation pump, a cooling water coil arranged at the bottom of the activation ...

AI Technical Summary

Problems solved by technology

[0003] For this reason, the technical problem to be solved by the present invention is that the outlet of the pump return pipe in the circulation pipe of the activation cylinder is directly arranged on the top of the activation cylinder in the prior art, and the liquid medicine directly flows back to the activation cylinder from the top of the activation cylinder, and the injection is not uniform, and the circuit board is easily damaged. There was a problem of missing plating and infiltration of gold; and the potion was directly returned to the inlet of the activation solution pump, and the part did not flow, and the circulation of the liquid medicine in the tank could not be seen, and the added activation potion could not be quickly circulated to all parts of the activation tank; thus a new method was proposed. Uniform activation, no leakage of plating and gold infiltration, the potion can be quickly circulated to the printed circuit board immersion gold process of each part of the activation tank

Images