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Substrate processing device, nozzle, and substrate processing method

A substrate processing device and a technology for substrates, which are applied to devices for coating liquid on surfaces, electrical components, semiconductor/solid-state device manufacturing, etc., can solve problems such as inability to use new liquid, inability to supply new liquid uniformly, and disturbance of liquid level, etc.

Active Publication Date: 2017-10-03
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in these cases, the liquid level of the new liquid extending in the width direction of the substrate may be disturbed by the air.
As a result, the new liquid cannot be supplied uniformly, so there is a possibility that the substrate cannot be uniformly processed with the new liquid.

Method used

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  • Substrate processing device, nozzle, and substrate processing method
  • Substrate processing device, nozzle, and substrate processing method
  • Substrate processing device, nozzle, and substrate processing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0106]

[0107] figure 1 It is a schematic plan view showing a substrate processing system 100 including the substrate processing apparatus 1 .

[0108] The substrate processing system 100 processes a square glass substrate (hereinafter simply referred to as a substrate) 90 for manufacturing a screen panel of a liquid crystal display device.

[0109] The substrate processing system 100 includes a loading unit 10 , a cleaning unit 11 , a divide bake unit 12 , a coating unit 13 , a reduced-pressure drying unit 14 , and a pre-bake unit 15 . The carrying-in unit 10 is a part that receives a substrate 90 to be processed in the substrate processing system 100 . The cleaning unit 11 cleans and cleans the substrate 90 carried in by the carrying-in unit 10 . The divided baking unit 12 dries the substrate 90 to which the cleaning liquid adhered in the cleaning unit 11 .

[0110] The coating unit 13 coats a processing liquid (here, a resist) on the surface of the substrate 90 dried ...

no. 2 Embodiment approach

[0150] The substrate processing apparatus 1 of the above-described embodiment includes two nozzles (a rinse coating nozzle 32 and a liquid knife nozzle 33 ) in the rinse unit 30 . However, it is also conceivable to configure these two nozzles with one nozzle. In addition, in the following description, members having the same functions as those already described are assigned the same symbols or symbols with alphabets (alphabets) added thereto, and detailed explanations may be omitted.

[0151] Image 6 It is an enlarged schematic side view showing a boundary portion between the developing unit 20 and the rinse unit 30A in the substrate processing apparatus 1A according to the second embodiment. like Image 6 As shown, the substrate processing apparatus 1A is different from the substrate processing apparatus 1 in that a single nozzle 36 is provided instead of the rinse lamination nozzle 32 and the liquid knife nozzle 33 .

[0152] The nozzle 36 has a first discharge part 32A ...

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Abstract

The invention provides a substrate processing device, a nozzle, and a substrate processing method, and provides a technology for uniformly processing a substrate adhered with a pretreatment liquid by using a processing liquid. The substrate processing apparatus conveys the substrate with the developer attached thereto from the upstream side toward the downstream side in the conveying direction (third direction) by a plurality of conveying rollers; the air nozzle supplies curtain-shaped air to the surface of the substrate conveyed toward the downstream side to remove the buildup. The developer on the substrate; the rinse liquid nozzle is arranged on the downstream side of the air nozzle, and sprays the rinse liquid from the outlet formed on the lower surface to the substrate; the rinse liquid sprayed from the rinse liquid nozzle toward the substrate contacts the substrate and the lower surface. surface, and spread in the gap between the substrate and the lower surface; the liquid knife nozzle is arranged on the downstream side of the flushing liquid nozzle, and sprays a thin film of flushing liquid to the substrate.

Description

technical field [0001] The present invention relates to a technique for replacing and treating a substrate to which a pretreatment liquid adheres with another treatment liquid. Background technique [0002] Conventionally, there has also been proposed a technique in which a substrate to which another processing liquid adheres is replaced with a new processing liquid to process the substrate (for example, Patent Document 1). [0003] The residual liquid removal device disclosed in Patent Document 1 has a structure in which the stripping liquid (old liquid) supplied to the glass substrate is replaced with a new stripping liquid in resist stripping equipment for manufacturing liquid crystal panels. liquid (new liquid). More specifically, the residual liquid removal device blows curtain-shaped air from the first liquid removal member toward the moving glass substrate to remove the stripping liquid (old liquid). Then, a new stripping liquid (new liquid) is supplied to the glass...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67B05C11/00
Inventor 山下永二富藤幸雄羽方满之
Owner DAINIPPON SCREEN MTG CO LTD
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