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Apparatus and method for processing substrates

A technology of a substrate processing device and a substrate processing method, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem that the chip cannot provide the best exhaust speed, shorten the exhaust time, and prevent the deformation of the chip position , the effect of efficient process processing

Inactive Publication Date: 2015-10-14
PSK INC
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  • Summary
  • Abstract
  • Description
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Problems solved by technology

Generally, the exhaust unit has one low-speed piping, so there is a problem that it cannot provide the optimal exhaust speed up to the set pressure depending on the type of chip.

Method used

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  • Apparatus and method for processing substrates
  • Apparatus and method for processing substrates
  • Apparatus and method for processing substrates

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Embodiment Construction

[0091] Refer below with attached Figure 1 With the detailed description of the embodiments, the advantages and features of the present invention and the method for realizing them will be clarified. However, the present invention is not limited to the embodiments disclosed below, and can be embodied in various ways that are different from each other. The embodiments of the present invention are only used to make the disclosure of the present invention more comprehensive, so that those skilled in the art can more completely It is understood that the scope of the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals denote the same constituent elements.

[0092] In an embodiment of the present invention, the size of the fluid passage means that in the plate ( Figure 4 640) is the area where the fluid can flow. In addition, when the board is not provided ( Figure 4 In the case of 640), the size of the fluid p...

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Abstract

The present invention provides an apparatus and method for processing substrates. The apparatus for processing substrates includes: a working procedure chamber and an exhaust unit. The exhaust unit has an exhaust pipeline connected to the working procedure chamber, and a pump arranged in the exhaust pipeline for adjusting the pressure in the working procedure chamber. The exhaust pipeline is composed of a high-speed tube and a plurality of low-speed tubes. The present invention also provides a method for processing substrates. The method includes the steps as follows: reducing pressure in the working procedure chamber to a working procedure pressure so as to process substrates, closing a high-speed valve before the pressure reducing enables the inner pressure of the working procedure chamber to meet a preset pressure, and opening a low-speed valve selected from low-speed valves; closing the selected low-speed valve when the inner pressure of the working procedure chamber meets the preset pressure, and opening the high-speed valve.

Description

technical field [0001] The present invention relates to a substrate processing device and method, in particular, the present invention relates to a substrate processing device and method with an exhaust unit. Background technique [0002] To manufacture semiconductor devices, various processes such as deposition, exposure, ashing, and washing are involved. Among them, processes such as deposition, etching, and ashing are performed in a vacuum state. In this semiconductor process, various fine circuit patterns such as line or space patterns are formed on the substrate, or in the ion implantation process, photolithography used as a mask is used The glue is mainly removed from the substrate by means of an ashing process. The ashing process is carried out in a process chamber isolated from the outside, and the reaction gas, unreacted gas and reaction by-products generated during the ashing process are discharged to the outside through the exhaust pipeline connected to the proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02H01L21/67017
Inventor 南承庆
Owner PSK INC
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