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Automatic cleaning wafer edge clamping mechanism

A fully automatic cleaning and edge clamping technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., to achieve the effect of facilitating installation and debugging, improving equipment capacity, and improving production efficiency

Active Publication Date: 2015-10-14
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The clamping mechanism solves the problem of wafer edge clamping in fully automatic cleaning, and can realize automatic clamping and loosening of the wafer edge

Method used

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  • Automatic cleaning wafer edge clamping mechanism
  • Automatic cleaning wafer edge clamping mechanism
  • Automatic cleaning wafer edge clamping mechanism

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Embodiment Construction

[0015] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0016] The centrifuge unit for fully automatic wafer cleaning includes a wafer holder 6, a spindle motor 7 and a casing, the spindle motor 7 is installed in the casing, the wafer holder 6 is driven to rotate by the spindle motor 7, and the wafer 2 is placed on the wafer holder 6, rotate together with the wafer table 6.

[0017] Such as figure 1 As shown, the present invention includes a gripper 1, a thimble 3 and a lifting cylinder 4, and on the edge of the wafer table 6, a plurality of grippers 1 are evenly distributed along the circumferential direction (the gripper 1 of this embodiment is two ), each holder 1 rotates with the wafer stage 6 . The number of lifting cylinders 4 equal to the number of holders 1 is installed outside the casing, that is, there is a lifting cylinder 4 fixed on the outer surface of the casing directly under each holder 1, and th...

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Abstract

The invention belongs to the field of semiconductor wafer cleaning, and specifically relates to an automatic cleaning wafer edge clamping mechanism. The automatic cleaning wafer edge clamping mechanism comprises clampers, thimbles and elevating cylinders, wherein the multiple clampers are uniformly distributed along the edge of a wafer carrying table in a centrifuge unit, the casing of the centrifuge unit is externally provided with the elevating cylinders in the same quantity as the clampers, and the output end of each elevating cylinder is provided with one thimble; the clampers comprise spring sleeves, springs, limiting sleeves and spring guide rods, the limiting sleeves are installed at the edge of the wafer carrying table, the spring sleeves cover the limiting sleeves, the spring guide rods are disposed inside the spring sleeves and are supported through the limiting sleeves, the springs are sleeved on the spring guide rods, and the two ends of each spring respectively abut against the spring sleeves and the spring guide rods; and the elevating cylinders drive the thimbles to elevate so as to drive the spring guide rods to elevate, and the edge of a wafer placed on the wafer carrying table is clamped by the spring guide rods. According to the invention, the edge of the wafer can be automatically clamped and loosened, and the requirement for clamping the edge of the wafer in a semiconductor cleaning technology is met.

Description

technical field [0001] The invention belongs to the field of semiconductor wafer cleaning, in particular to a fully automatic cleaning wafer edge clamping mechanism. Background technique [0002] At present, in the semiconductor process, the wafer clamping method is mainly vacuum adsorption. The existing method of vacuum adsorption of wafers has high technical requirements for wafer surface cleaning, and cannot be clamped by contact vacuum adsorption, and the existing technology cannot fully meet the requirements. Contents of the invention [0003] In order to overcome the above-mentioned problems existing in the existing method of clamping wafers by vacuum adsorption, the object of the present invention is to provide a fully automatic cleaning wafer edge clamping mechanism. The clamping mechanism solves the problem of wafer edge clamping in fully automatic cleaning, and can realize automatic clamping and loosening of the wafer edge. [0004] The purpose of the present i...

Claims

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Application Information

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IPC IPC(8): H01L21/687
Inventor 耿克涛李晓飞
Owner SHENYANG KINGSEMI CO LTD
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