A method of peeling ultra-thin glass from a carrier substrate
A technology for carrying substrates and ultra-thin glass, which is used in semiconductor devices, electrical components, circuits, etc., can solve the problems of lowering yield and poor peeling efficiency of ultra-thin glass, so as to improve the yield, improve efficiency, and avoid heat failure. uniform effect
Active Publication Date: 2018-01-16
BOE TECH GRP CO LTD
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Problems solved by technology
[0006] The invention provides a method for peeling ultra-thin glass from a carrier substrate, which is used to solve the problem in the prior art that the efficiency of peeling ultra-thin glass from the carrier substrate is poor, thereby reducing the yield
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Embodiment Construction
[0053] In the embodiment of the present invention, at least one tubular object is formed on a carrier substrate, and / or at least one channel is formed on the carrier substrate; an adhesive layer is formed between the carrier substrate and the ultra-thin glass; The nozzle of the object passes the release agent into the tubular object and / or passes the release agent into the channel through at least one of the channel openings of the channel, so that the released agent and the The adhesive layer is in contact; after the release agent chemically reacts with the adhesive layer, the ultra-thin glass is peeled off the carrier substrate. Since at least one tubular object is formed on the carrier substrate and / or at least one channel is formed on the carrier substrate in the embodiment of the present invention, the release agent is introduced through the nozzle of the at least one tubular object and / or the channel opening of the at least one channel, Contact with the adhesive layer inc...
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The invention discloses a method for peeling ultra-thin glass from a carrier substrate, which is used to solve the problem of poor efficiency in peeling off the ultra-thin glass and the carrier substrate in the prior art, thereby reducing the yield. The method of the present invention comprises: forming at least one tubular object on the carrier substrate, and / or forming at least one channel on the carrier substrate; forming an adhesive layer between the carrier substrate and the ultra-thin glass; passing through the nozzle of the at least one tubular object Pass the stripping agent into the tubular object and / or pass the stripping agent into the channel through the channel opening of at least one channel, so that the passed-in stripping agent is in contact with the adhesive layer; after the stripping agent and the adhesive layer are chemically reacted, the The ultra-thin glass is peeled from the carrier substrate. The method of the invention can improve the efficiency of peeling off the ultra-thin glass and the carrier substrate, and improve the yield.
Description
Technical field [0001] The present invention relates to the field of display technology, in particular to a method for peeling ultra-thin glass from a carrier substrate. Background technique [0002] In the prior art, an ultra-thin display device is usually manufactured by a manufacturing method of thinning glass or a manufacturing method of attaching an ultra-thin glass to a carrier substrate. The manufacturing method of the thinned glass requires grinding / polishing of the glass after the display device is manufactured, but the grinding / polishing process is very complicated and expensive. [0003] The manufacturing method of the ultra-thin glass attached to the carrier substrate includes: first, the ultra-thin glass and the carrier substrate need to be attached through the adhesive layer (such as Figure 1a As shown, the schematic diagram of the ultra-thin glass and the carrier substrate after being attached through the adhesive layer, from Figure 1a It can be seen that a is the ca...
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IPC IPC(8): H01L21/77
CPCH01L27/1266
Inventor 左岳平刘建宏李良坚马应海
Owner BOE TECH GRP CO LTD