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High-precision through hole plate

A high-precision, through-hole technology, applied in the direction of electrical connection of printed components, printed circuit components, electrical components, etc., can solve the problems of silver paste migration, insulation resistance resistance drop, etc., to achieve reasonable setting, avoid resistance drop, low-cost effects

Inactive Publication Date: 2015-10-14
ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to aim at the defects and deficiencies of the prior art, to provide a high-precision perforated plate with simple structure, reasonable design and convenient use, which solves the migration phenomenon of silver glue caused by temperature and humidity in the prior art, Avoid the problem of insulation resistance drop caused by this problem

Method used

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with the accompanying drawings.

[0015] see figure 1 As shown, the technical solution adopted in this specific embodiment is: it includes a copper clad laminate base material 1, a through hole 2, a solder resist layer 3, a copper foil 4, silver glue 5, and a protective layer 6; the copper clad laminate base material 1 is provided with Through hole 2, copper foil 4 is provided on the upper and lower sides of through hole 2, silver glue 5 is arranged on the outside of copper foil 4, protective layer 6 is arranged on the outside of silver glue 5, and anti-corrosion layer is arranged on the side of copper foil 4. Welding layer 3 ; the outer edge of the through hole 2 is provided with a diffusion-resistant layer 7 .

[0016] The diffusion-resistant layer 7 is a ceramic insulating diffusion-resistant layer.

[0017] The working principle of this specific embodiment: by adding the anti-spreading layer 7, t...

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Abstract

The present invention discloses a high-precision through hole plate and relates to the technical field of circuit boards. The high-precision through hole plate comprises a copper clad laminate substrate, a through hole, welding prevention layers, copper foils, silver colloids and protective layers, wherein the through hole is formed in the copper clad laminate substrate, the copper foils are respectively arranged at the upper and lower sides of the through hole, the silver colloids are arranged at the external parts of the corresponding copper foils, the protective layers are arranged at the external parts of the corresponding silver colloids, and the welding prevention layers are arranged on the side surfaces of the corresponding copper foils; and spreading prevention layers are arranged at the outer edges of the through hole. According to the high-precision through hole plate disclosed by the present invention, the problems in the prior art of migration of the silver colloids caused by the temperature and the humidity and decrease of a resistance value of an insulation resistor caused by the migration of the silver colloids are overcome.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to high-precision through-hole boards. Background technique [0002] The names of circuit boards are: circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. The circuit board can be called a printed circuit board or a printed circuit board, and the English name is (Printed Circuit Board) PCB. Printed circuit boards are the providers of electrical connections for electronic components. Its development has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is that it greatly re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11
CPCH05K1/116H05K2201/0769
Inventor 赵晶凯
Owner ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD