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Technology for electrocoppering

A copper electroplating and process technology, applied in the direction of circuits, semiconductor devices, etc., can solve the problems of incomplete application of the process, damage, and drop in electroplating efficiency, and achieve the effects of reducing process preparation time, improving production efficiency, and facilitating grinding and molding

Inactive Publication Date: 2015-10-21
SUZHOU HUARI JINLING MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in complex electroplating structures, the electroplating efficiency decreases, and this process cannot be fully applied under complex electroplating structures
The most critical problem is that the annealing and polishing work after more plating tanks will cause damage to the body

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A kind of technique of electroplating copper, concrete steps are as follows:

[0025] 1) Prepare to deposit an etch stop layer; set an insulating layer on the etch stop layer;

[0026] 2) Make wire grooves on the insulating layer;

[0027] 3) Metal copper is arranged in the wire groove; the metal copper forms a copper wire along the wire groove; it is characterized in that:

[0028] 4) After the copper wire is formed in step 3), the etch stop layer is placed in a low temperature environment for rapid cooling;

[0029] 5) After cooling to a certain temperature, the metal copper wire is electroplated;

[0030] 6) After the surface is polished, it is polished and cleaned.

[0031] Temperature of cryogenic environment -10° to -15°

[0032] As a preferred solution of the copper electroplating process of the present invention, in the step 3), metal copper is laid in the wire groove by superimposed deposition.

[0033] As a preferred solution of the copper electroplating ...

Embodiment 2

[0037] A kind of technique of electroplating copper, concrete steps are as follows:

[0038] 1) Prepare to deposit an etch stop layer; set an insulating layer on the etch stop layer;

[0039] 2) Make wire grooves on the insulating layer;

[0040] 3) Metal copper is arranged in the wire groove; the metal copper forms a copper wire along the wire groove; it is characterized in that:

[0041] 4) After the copper wire is formed in step 3), the etch stop layer is placed in a low temperature environment for rapid cooling;

[0042] 5) After cooling to a certain temperature, the metal copper wire is electroplated;

[0043] 6) After the surface is polished, it is polished and cleaned.

[0044] The temperature of the cryogenic environment is -10°.

[0045] As a preferred solution of the copper electroplating process of the present invention, in the step 3), metal copper is laid in the wire groove by superimposed deposition.

[0046] As a preferred solution of the copper electroplat...

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PUM

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Abstract

The invention relates to a technology for electrocoppering, and belongs to the field of semiconductor preparation. The technology for electrocoppering comprises the specific steps that sedimentation is conducted on an etching stop layer; an insulating layer is arranged on the etching stop layer; a wiring trough is manufactured in the insulating layer; metallic copper is arranged in the wiring trough; the metallic copper forms a copper wire along the wiring trough; quick cooling is conducted in the low-temperature environment; electroplating is conducted on the metal copper wire after cooling to a certain temperature; polishing and cleaning treatment are conducted after surface polishing is finished. The technology for electrocoppering has the advantages that fixing and nature determination are conducted on the wire by using the low-temperature environment, polishing and forming in the following step are convenient, the low-temperature environment contributes to wire forming, the time on technological preparation can be reduced, and the working efficiency is improved greatly.

Description

technical field [0001] The invention relates to a process for electroplating copper, which belongs to the field of semiconductor preparation. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation ( Such as rust), improve wear resistance, electrical conductivity, reflective properties, corrosion resistance (copper sulfate, etc.) and enhance the appearance. [0003] Electroplating requires a low-voltage high-current power supply to supply power to the electroplating tank and an electrolytic device consisting of an electroplating solution, a part to be plated (cathode) and an anode. The composition of the electroplating solution varies depending on the plating layer, but they all contain the main salt that...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D7/12
Inventor 向延海
Owner SUZHOU HUARI JINLING MACHINERY
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