an environmental sensor
An environmental sensor and sensor chip technology, applied in the field of measurement, can solve the problems of increasing the manufacturing process, unfavorable miniaturization development of environmental sensors, etc., to achieve the effect of saving space, satisfying the development of miniaturization, and reducing the size
Active Publication Date: 2019-04-30
GOERTEK MICROELECTRONICS CO LTD
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Problems solved by technology
Such a connection method not only increases the production process, but also is not conducive to the miniaturization of environmental sensors.
Method used
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[0021] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
[0022] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.
[0023] Techniques and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques and devices should be considered part of the description.
[0024] In all examples shown and discussed herein, any specific values should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have different values.
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The invention relates to an environmental sensor comprising a sensor chip disposed inside a first external package. An ASIC chip is welded to the outer side of the first external package by mounting a tin ball. The input end of the ASIC chip is electrically connected with one end of an ASIC input end wire arranged on the first external package. The output end of the sensor chip is electrically connected with the other end of the ASIC input end wire. A second external package used for packaging the ASIC chip is arranged at the outer side of the first external package. According to the environmental sensor, the ASIC chip and the sensor chip are arranged separately, so that foreign matters can be prevented from going inside, and the ASIC chip is protected from damage; and meanwhile, the ASIC chip and the sensor chip can be mounted in the vertical direction, so that the size of the whole environmental sensor is reduced, the space of external packaging can be reduced, and the product can be made smaller to meet the demand for miniaturization of modern electronic products.
Description
technical field [0001] The present invention relates to the measurement field, more specifically, to a sensor, especially to an environment sensor. Background technique [0002] The environmental sensor uses the relevant physical effects of sensitive materials, such as piezoresistive effect, piezoelectric effect, etc. After the sensitive material is affected by the environmental variable, its resistance or capacitance changes, and the measurement circuit can be obtained proportional to the change of the environmental variable. Environmental sensors have been widely used in the measurement and control of air pressure, altitude, temperature and humidity, gas and other fields. [0003] In recent years, with the development of science and technology, the volume of electronic products such as mobile phones and notebook computers has been continuously reduced, and people have higher and higher performance requirements for these portable electronic products, which requires the supp...
Claims
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IPC IPC(8): G01D5/12
Inventor 张俊德
Owner GOERTEK MICROELECTRONICS CO LTD