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Semiconductor light-emitting chip scale package

A technology of light-emitting chips and semiconductors, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as low light extraction efficiency

Inactive Publication Date: 2015-10-21
FOSHAN CITY NANHAI DISTRICT LIANHE GUANGODNG XINGUANGYUAN IND INNOVATION CENT +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the light extraction efficiency of the existing semiconductor light emitting chip scale package is low

Method used

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  • Semiconductor light-emitting chip scale package
  • Semiconductor light-emitting chip scale package
  • Semiconductor light-emitting chip scale package

Examples

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Embodiment Construction

[0083] In order to make the purpose, technical solutions and advantages of the implementation examples of the present invention clearer, the technical solutions in the implementation examples of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the implementation examples of the present invention. Obviously, the described The implementation examples are some implementation examples of the present invention, but not all implementation examples. Based on the implementation examples in the present invention, all other implementation examples obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0084] Figure 1a A cross-sectional view showing one embodiment of an epitaxial layer in a chip scale package of the present invention. The epitaxial layer includes a first epitaxial layer 1, a light-emitting layer 3 and a second epitaxia...

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Abstract

The invention discloses a semiconductor light-emitting chip scale package, which comprises at least one semiconductor light-emitting epitaxial layer and a covering. The semiconductor light-emitting epitaxial layer comprises a first epitaxial layer, a light-emitting layer and a second epitaxial layer, so that the semiconductor light-emitting epitaxial layer emits light after being electrified. The covering covers the first epitaxial layer of the semiconductor light-emitting epitaxial layer as well as four side surfaces of the semiconductor light-emitting epitaxial layer. A first metal electrode is formed on the first epitaxial layer, a second metal electrode is formed on the second epitaxial layer, and the first metal electrode and the second metal electrode are positioned on the same plane. The covering is of a single-layer or multilayer structure.

Description

technical field [0001] The invention relates to a semiconductor light-emitting chip scale package. Background technique [0002] One of the ways to quickly reduce the cost of LED lighting lighting systems is to use chip-scale packaging. However, the light extraction efficiency of the existing semiconductor light emitting chip scale package is low. Therefore, it is necessary to improve the light extraction efficiency. Contents of the invention [0003] The object of the present invention is to provide a semiconductor light emitting chip scale package capable of improving light extraction efficiency. Hereinafter, the semiconductor light emitting chip scale package is referred to as chip scale package (Chip Scale Package, CSP for short). [0004] One embodiment of the chip-scale package of the present invention: a semiconductor light-emitting chip-scale package, characterized in that the semiconductor light-emitting chip-scale package includes at least one semiconductor ep...

Claims

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Application Information

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IPC IPC(8): H01L33/22H01L33/48H01L33/56
CPCH01L33/22H01L33/48H01L33/56
Inventor 彭晖眭世荣黄映仪
Owner FOSHAN CITY NANHAI DISTRICT LIANHE GUANGODNG XINGUANGYUAN IND INNOVATION CENT