Method and system for predicting random vibration life of PCB solder point

A fatigue life prediction, random vibration technology, applied in special data processing applications, instruments, electrical digital data processing, etc., to achieve accurate prediction results, accurate data acquisition, and strong operability.

Active Publication Date: 2015-11-04
FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide an accurate and operable random vibration fatigue life prediction method for PCB solder joints in view of the problem that there is no accurate and operable random vibration fatigue life prediction method for PCB solder joints. method and system

Method used

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  • Method and system for predicting random vibration life of PCB solder point
  • Method and system for predicting random vibration life of PCB solder point
  • Method and system for predicting random vibration life of PCB solder point

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Embodiment Construction

[0025] Such as figure 1 As shown, a random vibration fatigue life prediction method for PCB solder joints includes steps:

[0026] S100: Based on the harmonic response simulation analysis of the sinusoidal vibration test, determine the stress-life curve of the PCB solder joint.

[0027] The stress-life curve of PCB solder joints can be obtained based on historical data simulation analysis, or real-time data collection simulation analysis.

[0028] In one of the embodiments, step S100 may include:

[0029] Step 1: Conduct a static simulation experiment on the PCB to obtain the main frequency and formation of each order of the PCB components;

[0030] Step 2: Taking the first-order main frequency as the center frequency, apply acceleration excitations of different magnitudes, conduct sinusoidal vibration tests, record the failure time of solder joints under acceleration excitations of different magnitudes, and calculate the number of solder joint failure cycles;

[0031] Step...

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Abstract

The invention provides a method and a system for predicting random vibration life of a PCB solder point. Based on a sinusoidal vibration test and harmonic response simulation analysis, a stress-life curve of the PCB solder point is determined; According to a stress-time curve of a random vibration fatigue dangerous part of the PCB solder point or a strain-life curve of a PCB, the cycle number, stress amplitude and mean distribution of the random vibration fatigue dangerous part of the PCB solder point are determined with a rain-flow counting method; the random vibration fatigue loss of the PCB solder point is determined; and finally based on a Miner rule, according to the random vibration fatigue loss of the PCB solder point, the random vibration life of the PCB solder point is predicted. The whole process is based on precise data processing, the operability is strong, and a stress and time response signal is subjected to cycle number statistics and sorting with the rain-flow counting method, so that the data acquisition accuracy in the process for predicting the random vibration life of the PCB solder point is ensured.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method and system for predicting fatigue life of random vibration of PCB solder joints. Background technique [0002] The failure of electronic products can be generally classified into three types according to its inducing factors: vibration failure, impact failure and thermal failure. Electronic products are often subjected to a series of different vibration loads during manufacturing, transportation and service, especially the service environment of avionics systems and automotive electronic systems is more severe, and vibration failure is one of the important factors affecting the reliability of electronic products. The reliability of PCB solder joints in electronic products is directly related to the service life of the product, but at present, the vibration life prediction of solder joints, especially random vibration life predic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 周斌何小琦恩云飞卢桃周振威
Owner FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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