Fingerprint identification module

Abstract

The invention discloses a fingerprint identification module. The fingerprint identification module comprises an electrics mechanism and a mechanics mechanism, and the mechanics mechanism is arranged at the periphery of the electrics mechanism and is used for diverting the pressure applied onto the electrics mechanism. The mechanics mechanism comprises an upper cover plate and a force conduction part, wherein the middle part of the force conduction part is hollowed out. The upper cover plate is arranged at the top of the force conduction part and forms an accommodation space together with the force conduction part. The electrics mechanism comprises a circuit board and a fingerprint identification chip. The circuit board comprises an extension part and a connection part. The fingerprint identification chip is arranged in the accommodation space and is electrically connected with the connection part via a conductive element. The end surface of the top of the fingerprint identification chip is fixedly connected with the end surface of the bottom of the upper cover plate. The horizontal height of the end surface of the bottom of the connection part is higher than the horizontal height of the end surface of the bottom of the mechanics mechanism. Compared with the prior art, the pressure applied onto the electrics mechanism is dispersed by the mechanics mechanism. In this way, during the usage process, the electrics mechanism is well protected. Therefore, the service life of the fingerprint identification module is obviously prolonged.

Description

technical field [0001] The invention relates to the technical field of manufacturing and packaging of fingerprint identification modules. Background technique [0002] Since the fingerprint has characteristics such as lifelong invariance and uniqueness, the identity of the user can be accurately and reliably identified by identifying the fingerprint. The fingerprint identification module is a device that uses fingerprint identification technology to obtain the user's fingerprint image conveniently and quickly, and then identifies the user's identity. [0003] The fingerprint identification module disclosed in the prior art includes an electrical mechanism (the electrical mechanism includes a fingerprint identification chip and a circuit board), but no independent mechanical mechanism is provided, and the electrical mechanism is directly fixed between the upper cover and the lower cover during manufacture. , because the upper and lower end faces of the electrical mechanism a...

AI Technical Summary

Problems solved by technology

[0003] The fingerprint identification module disclosed in the prior art includes an electrical mechanism (the electrical mechanism includes a fingerprint identification chip and a circuit board), but no independent mechanical mechanism is provided, and the electrical mechanism is directly fixed between the upper cover and the lower cover during manufacture. , because the upper and lower end faces of the electrical mechanism are fixedly connected to the upper and lower cover plates respectively, when in use, the force applied by the user's finger to press the fingerprint recognition module is directly transmitted to the electrical mechanism, which may easily lead to mechanical damage of the electrical mechanism or cause electrical mechanism damage. The conductive material between the various components is loose, which leads to poor contact. The above faults will directly affect the service life of the fingerprint identification module.

[0004] In response to the above problems, fingerprint identification module manufacturers also have some existing solutions. For example, Apple adopts an evasive approach and does not solder on the back of the fingerprint identification chip, but connects to the circuit board from the side of the chip. This design leads to fingerprint identification. The manufacturing cost of the identification module is high, and the yield rate is low; the fingerprint module adopted by Huawei Mate7 uses a layer of foam under the fingerprint identification chip and maximizes the soldering area on the back of the chip. Essentially improving the pressure resistance of the chip, Huawei placed the fingerprint module on the back of the mobile phone that is not often under pressure. At the same time, because of its large size, it is not suitable for industrial design of small and medium-sized mobile phones.

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