Unlock instant, AI-driven research and patent intelligence for your innovation.

Package integrity monitor with sacrificial bumps

An integrity and monitor technology, applied in the direction of instruments, measuring devices, electrical solid devices, etc., can solve problems such as increased mechanical stress and yield loss

Active Publication Date: 2015-11-11
XILINX INC
View PDF7 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there may be yield loss during the assembly process due to attachment failure between the micro-bumps on the die and the tabs on the interposer
Attach failure may occur with any micro-bumps on the die, but the problem is more likely to occur with micro-bumps located at the edge of the die due to increased mechanical stress at the outer edge of the die

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Package integrity monitor with sacrificial bumps
  • Package integrity monitor with sacrificial bumps
  • Package integrity monitor with sacrificial bumps

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] Various features will be described hereinafter with reference to the drawings. It should be noted that the drawings are not drawn to scale and elements having similar structures or functions are denoted by like reference numerals throughout the drawings. It should be noted that the diagram is only intended to help illustrate this feature. It is not intended to be an exhaustive description of the invention or to limit the scope of the invention. Furthermore, an exemplary embodiment need not possess all of the illustrated features or advantages. Features or advantages described with reference to a particular embodiment are not necessarily limited to that embodiment, but can be implemented in any other embodiment, even if not so stated or otherwise clearly The same goes for descriptions. At the same time, references to "some specific embodiments" or "other specific embodiments" throughout this specification mean that specific features, structures, materials, or characte...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An apparatus with package integrity monitoring capability, includes: a package having a die connected to an interposer through a plurality of bumps, wherein at least some of the bumps comprise dummy bumps; a package integrity monitor having a transmitter to transmit a test signal and a receiver to receive the test signal; and a first scan chain comprising a plurality of alternating interconnects in the die and in the interposer connecting some of the dummy bumps in series, wherein the first scan chain has a first end coupled to the transmitter of the package integrity monitor and a second end coupled to the receiver of the package integrity monitor.

Description

technical field [0001] Embodiments described herein relate to systems for monitoring the package integrity of integrated circuit (IC) packages. Background technique [0002] In many integrated circuit systems, connecting a die to an interposer is accomplished by attaching microbumps on the die to corresponding tabs on the interposer. However, yield loss may occur during the assembly process due to the failure of the attachment between the micro-bumps on the die and the tabs on the interposer. While attachment failure may occur with any micro-bumps on the die, the problem is more likely to occur with micro-bumps located at the edge of the die due to increased mechanical stress at the outer edges of the die. This problem leads to the use of a buffer zone containing sacrificial dummy bumps around the edge of the die. [0003] Dummy bumps on a die typically do not perform any function other than providing a buffer zone and meeting minimum density requirements. However, the ap...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L25/065G01R31/3187G01R31/3185
CPCG01R31/2896G01R31/31855H01L22/34H01L23/49816H01L23/49838H01L23/58H01L25/0657H01L2224/16225H01L2924/15192H01L2924/15311
Inventor 唐纳恰·罗尼玛利提斯·德拉多雷
Owner XILINX INC