Carrier band forming device and method

Abstract

The invention provides a carrier band forming device. The carrier band forming device comprises a rack, a gas input unit, an upper forming die, a lower forming die and a clamping unit, wherein the upper forming die, the lower forming die and the clamping unit are connected with the rack. The clamping unit is opposite to the lower forming die in position. The distance between the clamping unit and the lower forming die can be adjusted. The upper forming die comprises an upper die base body and a plurality of forming cylinders. The lower forming die is provided with a plurality of lower die holes corresponding to the forming cylinders in position. The upper die base body is connected with the rack through an upper die driving unit. Gaps are reserved between all the forming cylinders and the hole walls of the lower die holes. The gas input unit is connected with the lower forming die so that compressed gas can be input. By the adoption of the carrier band forming device, product quality can be improved, carrier band deformation is avoided, narrow center wall deep cavity carrier bands can be manufactured, and the manufacturing cost of the carrier bands is reduced. The invention further provides a carrier band forming method capable of lowering machining difficulty of the carrier bands, improving machining efficiency, avoiding carrier band deformation and achieving manufacturing of the narrow center wall deep cavity carrier bands.

Description

technical field [0001] The invention relates to the technical field of carrier tape forming, and more specifically, to a carrier tape forming device and method. Background technique [0002] Carrier tape is a strip-shaped product used in the field of electronic packaging. Cavities for holding electronic components are distributed equidistantly along its length; a middle wall is formed between adjacent cavities for electronic components. Quarantine. At present, the manufacturing methods of carrier tape generally include die stamping method and blow molding method. The die stamping method refers to the use of upper and lower dies to directly press the sheet into the required shape of the carrier tape. The blow molding method refers to placing the sheet on the mold, and setting an air cover above the sheet to form a sealed space, and blowing compressed air into the sealed space to make the sheet fit the mold and form it. [0003] With the development of science and technolog...

AI Technical Summary

Problems solved by technology

In the die stamping method, the cavity wall of the carrier tape is mainly formed by stretching and deforming a small area of ​​material; the cavity wall of a deep cavity needs to be greatly stretched on a small area of ​​material, which may easily cause the cavity wall to be too thin , or even breakage; if the width of the middle wall is designed to be small at this time, it is necessary to realize the stretching of two adjacent cavity walls on a small area of ​​material, so the die stamping method is even less likely to be applied to narrow Carrier tape manufacturing occasions for deep cavities in the middle wall

However, when the blow molding method is applied to the manufacture of carrier tapes with narrow walls and deep cavities, the blow molding equipment needs to adjust multiple parameters such as blow intensity and blow delay time, and it is difficult to obtain a good forming effect. Medium load belt is prone to deformation

Therefore, the existing two carrier tape manufacturing methods cannot produce a carrier tape with a narrow middle wall and a deep cavity; at present, manufacturers often meet the cavity depth requirements by widening the size of the sheet and widening the size of the middle wall

However, this approach increases the manufacturing cost of the carrier tape by at least 60%, which is not conducive to enterprises to seize the carrier tape market

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