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Perpendicular electroplating device

A vertical electroplating and equipment technology, applied in the electrolysis process, electrolysis components, etc., can solve the problems affecting the electroplating effect of the workpiece to be electroplated, affecting the product quality, and the vibration of the electroplating hanger structure, so as to improve the electroplating effect, avoid vibration, and enhance reliability. sexual effect

Active Publication Date: 2015-11-18
DONGGUAN WERY DOOD CIRCUIT BOARD EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the electroplating hanger device of the related art (that is, the electroplating flybar device), the structure of the reverse cut-off wheel is directly hinged to the fixed arm, so that the reverse cut-off wheel is perpendicular to There is no displacement in the direction of the conveying chain, and when the tooth top of the reverse cut-off wheel touches the shaft of the conveying chain, it will slip and jump, that is, the reverse cut-off wheel is separated from the conveying chain in an instant and then contacts , and the displacement difference in the vertical direction causes the reverse cut-off wheel to have a hard collision with the conveying chain in an instant, thereby causing the entire electroplating rack structure to vibrate, directly affecting the electroplating effect of the workpiece to be electroplated, and affecting product quality

Method used

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0022] Please also see Figure 1 to Figure 3 , figure 1 It is a schematic diagram of the three-dimensional structure of the electroplating rack device of the vertical electroplating equipment of the present invention. figure 2 It is a structural schematic diagram of the assembly of the electroplating hanger device and the fixture of the vertical electroplating equipment of the present invention. image 3 It is a structural schematic diagram of a working state of the electroplating rack device of the vertical electroplating equipment of the present invention. The vertical electroplating equipment (not shown) includes a conveyor chain (not shown) and an electroplating rack device 10 hung on the conveyor chain. The electroplating hanger device 10 includes a fixed arm 1, a delivery device (not labeled) and an adaptive adjustment device 3, the delivery d...

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Abstract

The invention discloses a perpendicular electroplating device which comprises a conveying chain and an electroplating hanger device hung on the conveying chain. The electroplating hanger device comprises a fixing arm, a conveying device and a self-adaptation adjusting device. The conveying device comprises reverse stop wheels, wherein the reverse stop wheels are connected to one side of the fixing arm. The positions of the reverse stop wheels are automatically adjusted by the self-adaptation adjusting device according to the stress situation of the reverse stop wheels so that the reverse stop wheels can be meshed with the conveying chain. Compared with the prior art, by means of the perpendicular electroplating device, rigid collisions between the reverse stop wheels and the conveying chain can be buffered, so that vibration of the electroplating hanger device is reduced or even avoided, and the electroplating effect of a workpiece to be electroplated is improved.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a vertical electroplating equipment with an automatic adjustment function in an electroplating production line. Background technique [0002] Electroplating is a very important process link in the field of printed circuit boards. At present, electroplating has three main functions in the process of printed circuit boards. The first is the traditional board surface electroplating, which coats the board with a layer of copper. Usually, it can also make vertical The holes in the direction of the board surface become connected, forming a 3D connected structure. Secondly, electroplating can also realize graphic electroplating, that is, a certain graphic is formed after exposure and development of the dry film, and then the graphic is highlighted by electroplating. Finally, there is hole filling electroplating, that is, through holes or blind holes are completely filled by elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D17/08
Inventor 甘林蔡志浩赵喜华肖昭荣
Owner DONGGUAN WERY DOOD CIRCUIT BOARD EQUIP
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