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BGA element detecting and positioning method based on linear clustering analysis

A technology of cluster analysis and positioning method, applied in the directions of surveying and navigation, measuring device, photogrammetry/video surveying, etc., can solve the problem of poor robustness, high complexity, and inability to apply BGA chip rotation and scale to non-uniform illumination. Scaling and other problems, to achieve the effect of fast and stable positioning and detection

Active Publication Date: 2015-11-18
宁波智能装备研究院有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the existing BGA chips based on template matching need to establish corresponding templates for each type of BGA chip, which cannot be applied to the situation that the BGA chips in the image are rotated and scaled; The BGA chip detection algorithm has a long algorithm time and high complexity; and in view of the problem of poor robustness of the above two algorithms to non-uniform illumination, a BGA component detection and positioning method based on linear clustering analysis is proposed.

Method used

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  • BGA element detecting and positioning method based on linear clustering analysis
  • BGA element detecting and positioning method based on linear clustering analysis
  • BGA element detecting and positioning method based on linear clustering analysis

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specific Embodiment approach 1

[0029] Specific implementation mode one: combine figure 1 Describe this embodiment, a kind of BGA component detection and location method based on linear clustering analysis described in this embodiment is specifically carried out according to the following steps:

[0030] Step 1. The gray-scale BGA chip image collected by the camera is the original image. Perform dynamic threshold segmentation to obtain the binary solder ball image, and perform morphological opening and closing operations on the binary solder ball image. The processed Each connected domain on the binary solder ball image is recorded as a binary BGA solder ball, and then the connected domain is marked for each binary BGA solder ball;

[0031] Wherein, the BGA solder ball is located on the BGA chip;

[0032] Step 2: Extract the grayscale connected domain of each binary BGA solder ball after connected domain marking obtained in step 1 within the neighborhood of the corresponding position on the original image, ...

specific Embodiment approach 2

[0043] Specific implementation mode two: combination figure 2 This embodiment is described. The difference between this embodiment and the first embodiment is that in the first step, the grayscale BGA chip image collected by the camera is the original image, and dynamic threshold segmentation is performed to obtain a binary solder ball image, and Perform morphological opening and closing operations on the binary solder ball image. Each connected domain on the processed binary solder ball image is recorded as a binary BGA solder ball, and then each binary BGA solder ball Connected domain marking is carried out; wherein, the BGA solder ball is located on the BGA chip; the specific process is:

[0044] The grayscale BGA chip image undergoes dynamic threshold segmentation to obtain a binary solder ball image I(x,y), as shown in the following formula:

[0045] I ( x , y ) = ...

specific Embodiment approach 3

[0048] Specific implementation mode three: combination image 3 This embodiment is described. The difference between this embodiment and the specific embodiment one or two is that in the step two, the corresponding position of each binary BGA solder ball obtained in the step one after the connected domain marking is obtained on the original image Extract the gray-scale connected domain within the neighborhood to obtain the complete gray-scale BGA solder ball of the original image, and establish a complete gray-scale BGA solder ball information list; wherein, the establishment of a complete gray-scale BGA solder ball information list includes: each complete The gray-scale pixels contained in the gray-scale BGA solder ball, and the coordinates of the center point of each complete gray-scale BGA solder ball calculated from the gray-scale pixels, the minimum outer circle diameter corresponding to each complete gray-scale BGA solder ball, each The area and roundness of the complete...

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Abstract

The invention relates to a BGA element detecting and positioning method based on linear clustering analysis, which aims to solve the problems that the existing BGA chip detecting method based on template matching is not suitable for BGA chip rotating and dimension zooming situations, the time complexity of the existing BGA chip detection algorithm based on point matching is high, and the two algorithms has poor robustness of illumination. The BGA element detecting and positioning method is implemented through the technical schemes of: extracting a gray level connected domain of BGA solder balls; establishing an information list; screening the list; carrying out local analysis on a solder ball array to determine a rough deflection angle of the BGA solder ball array; carrying out linear clustering on lines and columns of the BGA solder balls; solving a deflection angle and a central position of a BGA chip; searching the solder balls line by line to obtain a BGA solder ball mark matrix; and judging that the BGA element is defect-free if the BGA solder ball mark matrix is consistent with a standard solder ball mark matrix. The BGA element detecting and positioning method based on linear clustering analysis is applied to the fields of BGA element detection and positioning.

Description

technical field [0001] The invention relates to a BGA component detection and positioning method based on linear cluster analysis. Background technique [0002] Chips in the form of Ball Pin Array Package (BGA) have the characteristics of good reliability, small package area and excellent electrical performance, so they are widely used. The large-scale BGA chip mounting production process is mainly completed by the placement machine. The high-precision placement machine quickly mounts the chip on the printed circuit board through the steps of suction, displacement, identification, detection and positioning, and placement. [0003] The identification, detection and positioning of the chip by the placement machine is mainly completed by computer vision detection technology. This process includes two stages of teaching and detection: the teaching stage is to establish a chip standard parameter database by identifying standard samples; the detection operation With the chip stan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/08G01B11/24G01C11/00
Inventor 高会军靳万鑫于金泳杨宪强孙昊刘鑫
Owner 宁波智能装备研究院有限公司