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A Method for Determining Passive Intermodulation Products of Microwave Components

A microwave component and passive intermodulation technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problem of inability to directly determine the passive intermodulation products of microwave components, shorten the design cycle, improve analysis Accuracy, the effect of reducing development costs

Active Publication Date: 2018-01-05
XIAN INSTITUE OF SPACE RADIO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method still needs to infer other passive intermodulation products based on the known PIM level of a certain order, and cannot directly determine the PIM products of microwave components

Method used

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  • A Method for Determining Passive Intermodulation Products of Microwave Components
  • A Method for Determining Passive Intermodulation Products of Microwave Components
  • A Method for Determining Passive Intermodulation Products of Microwave Components

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Embodiment Construction

[0038] The specific embodiment of the present invention will be further described in detail below by taking the S-band aluminum alloy rectangular waveguide flange connection as an example.

[0039] 1) Set the structure, material parameters and input excitation signal of the microwave components.

[0040] Material parameters include: magnetic permeability μ of microwave component material, dielectric constant ε of component material, electrical conductivity σ of component material, density ρ of component material, heat capacity C p , thermal conductivity k, heat conduction velocity Thermal expansion coefficient α, Young's modulus M, initial stress s 0 , initial strain ε 0 , the elastic tensor C of the component material.

[0041] The excitation signal is two signals, the frequency is 4.5GHz and 5GHz, and the power is 1W respectively.

[0042]2) According to the center frequency of the excitation signal, the spatial grid division step length is obtained, and the microwave c...

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Abstract

A method for determining passive intermodulation products of microwave components. Starting from the factors affecting passive intermodulation, a coupling analysis model of electromagnetic field, temperature field, and stress-strain field is established, and corresponding coupling boundary conditions are constructed. On this basis, the The partial differential equation solver solves the analytical model to obtain the passive intermodulation level of the microwave component. The present invention combines the influence factors on the microwave components in the space-borne environment, considers the multi-dimensional change trends of factors such as electromagnetic power, temperature gradient, and stress distribution, and establishes a passive intermodulation multi-field coupling analysis model for space microwave components through a multi-dimensional coupling method. The passive intermodulation level under the influence of temperature and stress can be determined, and a more accurate analysis and evaluation of passive intermodulation products of microwave components can be realized.

Description

technical field [0001] The invention relates to a method for determining passive intermodulation products of microwave components, capable of determining passive intermodulation products under the influence of temperature and stress, mainly aimed at high-power microwave components carried by space vehicles, and belongs to the technical field of space special effects. Background technique [0002] The passive intermodulation effect is one of the outstanding problems that must be considered when studying spaceborne high-power microwave systems. With the development of modern communication systems in the direction of high power, wide bandwidth and high sensitivity, the impact of passive intermodulation on system performance will become more and more serious, and may even paralyze the entire system. Propose and implement the analysis method of passive intermodulation products, which can quickly and effectively evaluate the risk of passive intermodulation in spaceborne microwave ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 王瑞崔万照张娜李韵胡天存叶德信
Owner XIAN INSTITUE OF SPACE RADIO TECH