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Adhesive coating mechanism, device and method

A technology of encapsulation and tape, applied in packaging and other directions, can solve the problems of increasing labor costs, many personnel, industrial pollution and oxidation, etc., and achieve the effect of reducing damage

Active Publication Date: 2015-11-25
SHENZHEN YONGNENG MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing board edge wrapping work is mainly done manually. This manual wrapping has the following defects: 1) There are many people involved in the wrapping process, and the labor intensity is high, which increases the labor cost of the enterprise; 2) Touching the workpiece by hand is easy to cause Industrial Pollution Oxidation
[0004] With the rapid development of the economy, the existing manual encapsulation method can no longer meet the market demand, and there is an urgent need for an encapsulation equipment to realize mechanized encapsulation

Method used

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  • Adhesive coating mechanism, device and method
  • Adhesive coating mechanism, device and method
  • Adhesive coating mechanism, device and method

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Embodiment Construction

[0027] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be further described below in conjunction with the accompanying drawings.

[0028] Such as figure 1 As shown, the encapsulation mechanism 10 includes a fixing part 101 for fixing the tape, a stretching part 102 (also called a stretching wheel) for stretching the tape, a pressing part 103 and a support plate 104 . The stretching part 102 and the pressing part 103 are fixed on the supporting board 104 .

[0029] The fixing part 101 includes an upper plate 1011, a lower plate 1012, and an axis 1013. The upper plate 1011 and the lower plate 1012 are connected through the axis 1013, and the distance thereof is adjustable. Adhesive tape is placed between the upper plate 1011 and the lower plate 1012 . In order to adapt to tapes of different widths, the distance between the upper plate...

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Abstract

The invention discloses an adhesive coating mechanism, device and method. The adhesive coating mechanism comprises a fixing element used for fixing adhesive tape, an expansion element used for extending the adhesive tape, a pressing element used for pressing the adhesive tape, and a supporting plate. The expansion element is fixed at the feeding end of the supporting plate. The pressing element is fixed at a discharge end of the supporting plate. The pressing element is provided with an upper pressing part acting on the upper edge of the adhesive tape and a lower pressing part acting on the lower edge of the adhesive tape. By means of the adhesive coating mechanism, automation of adhesive coating and the continuous mechanical process are achieved. An adjusting element and the supporting plate are further arranged and can adapt to the adhesive coating process of workpieces with different widths. The pressing element of a rotary arm structure is further adopted so that non-friction pressing can be realized, and accordingly damage to parts and noise in the adhesive attaching process are reduced. Besides, adhesive coating of wide edge distances can be achieved. The adhesive coating mechanism is combined with adhesive cutting and workpiece distance detection to serve as an independent mechanism module, and then the adhesive coating mechanism can be assembled with different machines and used to be purchased by different users.

Description

technical field [0001] The invention relates to an edge-wrapping mechanism, in particular to a mechanism and a device and a glue-wrapping method for wrapping both sides of sheet workpieces such as PCB boards. Background technique [0002] For flat-plate workpieces such as plastic panels, display screens, and PCB boards, when electroplating and other treatments are performed on the surface of the board, it is necessary to wrap tape on the part of the board that does not need to be treated. [0003] The existing board edge wrapping work is mainly done manually. This manual wrapping has the following defects: 1) There are many people involved in the wrapping process, and the labor intensity is high, which increases the labor cost of the enterprise; 2) Touching the workpiece by hand is easy to cause Oxidation of industrial pollution. [0004] With the rapid development of the economy, the existing manual encapsulation method can no longer meet the market demand, and there is an...

Claims

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Application Information

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IPC IPC(8): B65B33/02
CPCB65B33/02
Inventor 张天星陆宇陈柏华苏敏森蒙永丰
Owner SHENZHEN YONGNENG MACHINERY
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