Chip screening method and apparatus
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Publication Date
- 2015-11-25
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Abstract
Description
technical field
[0001] The embodiments of the present invention relate to communication technologies, and in particular to a chip screening method and device. Background technique
[0002] The Factory Defective Parts Per Million (FDPPM) requirement for carrier-grade products is usually high. How to improve the quality of shipments and reduce the FDPPM of chips is the primary issue for manufacturers to improve profitability and customer satisfaction. One of the main reasons for the high FDPPM is the high early failure rate (Early Failure Rate, referred to as: EFR) of the chip. Screening out chips that may cause potential failure risks in the mass production test of the chip is a method to reduce the EFR. For example, a chip that is judged as a FailDie in the wafer test, although the surrounding PassDie can meet the wafer test specifications, the probability of early failure of these passDie chips is higher than that of passDie in other locations. , that is, the potential ris...