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Efficient heat radiating method and apparatus for electronic device

A technology of electronic devices and heat dissipation devices, applied in the field of high-efficiency heat dissipation methods and devices for electronic devices, can solve the problems of reducing the performance and service life of LED lamps, increasing the temperature of LED chips, and dissipating heat, so as to reduce the overall weight and material costs , prolong service life, fast heat dissipation effect

Inactive Publication Date: 2015-11-25
DALIAN MARITIME UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These radiators are feasible for low-power LED lamps, but for high-power LEDs, the heat generated by them cannot be dissipated quickly only through heat conduction, resulting in an increase in the temperature of the LED chip, which greatly reduces the performance and performance of the LED lamp. service life

Method used

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  • Efficient heat radiating method and apparatus for electronic device
  • Efficient heat radiating method and apparatus for electronic device
  • Efficient heat radiating method and apparatus for electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Such as Figure 1-3 As shown, the heat dissipation body is a cylindrical structure, and the heat dissipation fins 1 are evenly distributed on the outside of the heat dissipation body. The electronic device chip 4 is arranged at one end of the heat dissipation body cylindrical structure. When in use, other external structures can be arranged at this end. The common heat pipe 2 constitutes the cylindrical structure of the main body of heat dissipation. As a preliminary heat absorption unit, the pulsating heat pipe 3 is evenly arranged on the inner wall side of the common heat pipe 2 in a tight serpentine arrangement, that is, in a long U shape, and serves as a further heat sink. absorption unit.

Embodiment 2

[0041] Such as Figure 4-7 As shown, the heat dissipation body is a block structure, and the heat dissipation fins 1 are evenly distributed on one side thereof, and the electronic device chip 4 is arranged on the other side surface of the heat dissipation body opposite to the heat dissipation fins 1 . The ordinary heat pipes 2 are multiple groups of cylindrical pipes arranged side by side, and the pulsating heat pipes 3 are arranged in a serpentine winding between each of the ordinary heat pipes 2 , and the cross-sectional view shows that they are arranged in a staggered manner.

Embodiment 3

[0043] Such as Figure 8-11 As shown, the heat dissipation body is a block structure, and the heat dissipation fins 1 are evenly distributed on one side thereof, and the electronic device chip 4 is arranged on the other side surface of the heat dissipation body opposite to the heat dissipation fins 1 . The ordinary heat pipe 2 is a plurality of cylindrical pipes arranged side by side. The pulsating heat pipes 3 are arranged on the upper and lower sides of the ordinary heat pipe 2 in a serpentine shape, and the left and right sides of the ordinary heat pipe 2 are also distributed with pulsating heat pipes. This ensures uniform heat absorption.

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Abstract

The invention discloses an efficient heat radiating apparatus for an electronic device. The efficient heat radiating apparatus is characterized by comprising a heat radiating body and heat radiating fins arranged on the heat radiating body for radiating the heat from the heat radiating body to the environment; a chip of the electronic device is fixed on the heat radiating body; and the heat radiating body is in an efficient heat-transferring structure composed of at least one group of common heat pipes for initially absorbing the heat of the chip of the electronic device and pulsating heat pipes arranged around the common pipes at a preset configuration for further absorbing the heat. The invention also discloses a heat radiating method for the heat radiating apparatus; the heat from the chip of the electronic device is absorbed by the heat radiating body composed of the common heat pipes and the pulsating heat pipes; and then the heat is radiated to the environment through the heat radiating fins arranged on the heat radiating body. The efficient heat radiating method, by taking full advantages of the characteristics of the common heat pipes and the pulsating heat pipes to combine the pipes to work cooperatively, enables the whole heat radiating apparatus to be with the characteristics of super-high heat transferring capability, simple structure, portability, material conservation and the like.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a high-efficiency heat dissipation method and device for electronic devices. Background technique [0002] With the development of modern technology, electronic devices are gradually developing in the direction of miniaturization and integration. High-performance and high-power electronic devices will inevitably lead to a substantial increase in heat flux, so higher requirements are placed on heat dissipation. At present, the heat flux density of new computer chips can reach 100W / cm 2 , the total power is more than 300W. In addition, since the performance and lifespan of electronic components are affected by the working temperature, the normal working temperature range is -5°C to 65°C. When this normal working temperature is exceeded, the performance and lifespan of electronic components will be greatly reduced. The surface of electronic components maintains temperatur...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 纪玉龙郑飞宇孙玉清
Owner DALIAN MARITIME UNIVERSITY