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A package-free LED structure and LED lamp with uniform heat dissipation

A LED structure and uniform technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems that the heat of the tin bead cannot be dissipated evenly and quickly, and the chip is burned, so as to reduce the temperature, prevent burning, and conduct uniform and fast conduction. Effect

Active Publication Date: 2018-09-25
深圳创维光学科技有限公司
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Problems solved by technology

[0007] In view of the above-mentioned deficiencies in the prior art, the present invention provides a package-free LED structure with uniform heat dissipation, which aims to solve the problem that the existing package-free LED structure is prone to heat accumulation at the part where the solder ball connects the electrode and the substrate, resulting in the heat accumulation of the solder ball part. The heat cannot be dissipated evenly and quickly, which can easily lead to the problem of chip burnout

Method used

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  • A package-free LED structure and LED lamp with uniform heat dissipation
  • A package-free LED structure and LED lamp with uniform heat dissipation
  • A package-free LED structure and LED lamp with uniform heat dissipation

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[0027] The specific embodiments and examples of the present invention will be described in detail below in conjunction with the accompanying drawings. The described specific embodiments are only used to explain the present invention, and are not intended to limit the specific embodiments of the present invention.

[0028] Such as figure 2 and image 3 As shown, the package-free LED structure with uniform heat dissipation provided by the present invention includes a substrate 1, a chip 2 flip-chip mounted on the substrate 1, and a bracket 3 arranged on the periphery of the substrate 1, wherein the substrate 1 is provided with a The chip 2 is a polyhedral structure 10 with more than two layers staggered for heat dissipation. The polyhedron structure in the embodiment of the present invention may be a hexahedron structure. It can be understood that in other embodiments of the present invention, the polyhedron structure may be a structure with more edges and corners such as a pe...

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Abstract

The present invention discloses a packaging-free LED structure with uniform heat radiation and a LED lamp. The LED structure comprises a substrate, a chip inversely installed in the substrate, and a support arranged at the periphery of the substrate, wherein more than two layers of polyhedral structures for heat radiation of the chip are arranged on the substrate. According to the invention, the polyhedral structures are staggered on the substrate in a step-shaped manner to allow heat generated by the LED chip to be uniformly and quickly conducted in such a manner to avoid heat accumulation of the chip, reduce the temperature of the chip and prevent the chip from burning out, thereby ensuring the reliability of the LED product.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to a package-free LED structure with uniform heat dissipation and an LED lamp. Background technique [0002] At present, with the improvement of LED power and luminous efficiency, LED products featuring energy saving, fast response, small size, and high luminous efficiency are widely used in the fields of display product backlight and general lighting, and occupy an increasing market share. The market space is considered to be the best light source for the new generation of green energy-saving lighting. [0003] But at present, the photoelectric conversion efficiency of LED is still not high, especially for high-power LED devices, only 15%-20% of electrical energy is converted into light energy, and the remaining 80%-85% is converted into heat energy. If the heat generated by the chip cannot be exported and dissipated in time, a large amount of heat will accumulate inside the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/64
CPCH01L33/48H01L33/64H01L33/642
Inventor 孟长军周忠伟
Owner 深圳创维光学科技有限公司
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