Epoxy resin composition for copper-clad plate and application thereof

Abstract

The present invention relates to an epoxy resin composition for copper-clad plate and application thereof. The epoxy resin composition can be used for preparing a prepreg and a copper clad laminate. The epoxy resin composition uses brominated epoxy resins including low-bromine epoxy resin and high-bromide epoxy resin as a bromine source, and uses a phosphorus-containing phenanthrene compound as a phosphorus source; the ratio of the bromine source to phosphorus source in the epoxy resin composition is adjusted to control bromine content at 5-12% and phosphorus content at 0.2-1.5%; and the flame resistance reaches up to grade UL94V-0. Compared with pure bromine flame retardant copper-clad plate, the composition has higher heat resistance, and can achieve a higher CTI value; compared with pure phosphorus flame retardant copper-clad plate, the composition has low moisture absorption rate, and can provide the bonding properties and process operability required by printed circuit substrate. Compared to extensive use of aluminum hydroxide in conventional CTI sheet, the composition uses very small amount of or no aluminum hydroxide to achieve CTI of higher than 600V.

Description

technical field [0001] The invention relates to the technical field of laminated boards, in particular to an epoxy resin composition, and in particular to an epoxy resin composition for copper-clad laminates and prepregs, laminated boards and printed circuit boards made thereof. Background technique [0002] With the official implementation of the EU directives WEEE (Waste Electrical and Electronic Equipment) and RoHS (Restriction of Hazardous Substances), the global electronics industry has entered the era of lead-free soldering. Due to the increase of lead-free soldering temperature, higher requirements are put forward for the heat resistance and thermal stability of printed circuit copper clad laminates. Affected by the "green" regulations issued by the European Union, whether bromine should be used as a flame retardant element in the field of polymers has been pushed to the cusp of controversy. Although tetrabromobisphenol A has not been found to have any significant ne...

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Problems solved by technology

However, phosphorus element is easy to absorb moisture, and the moisture absorption rate of the flame-retardant board solely relying on phosphorus element is high, which is not conducive to the stability of the electrical properties of the board; and the current phosphorus-based flame retardants are generally expensive, and the cost pressure is relatively high. Therefore, although for There is a high demand for halogen-free, but it is currently unlikely to abandon bromine flame retardancy due to cost reasons

Chinese patent CN102093670A discloses a method for realizing flame retardancy with phosphorus-containing phenolic aldehydes containing 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) structure, although the water absorption of DOPO is lower It is lower than phosphoric acid ester, but due to its large dosage and phosphorus content above 2%, the moisture absorption rate has not been improved.

[0005] Although CN101892027 and CN101808466 disclose the sharing of bromine and phosphorus, both due to the use of a large amount of nitrile rubber, compared with epoxy resin, the water absorption rate of acrylonitrile structure is higher, and the voltage resistance of the composite substrate decreases. In addition, in nitrile rubber The acrylonitrile structure will accelerate the decomposition of bromine, which is unfavorable to the CTI performance of the bromine-containing system

However, not all of the phosphorus sources and bromine sources used in the above two patents are connected to the polymer main chain, and rubber has a negative impact on Tg, so it is difficult to achieve a higher glass transition temperature than the above two patents

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