Epoxy resin composition for copper-clad board and application thereof

Abstract

The invention relates to an epoxy resin composition for a copper-clad board and an application thereof. The epoxy resin composition comprises flame retardant additives containing phosphorus and flame retardant additives containing bromine and can be used for preparing prepreg and copper-clad laminated boards. According to the epoxy resin composition for the copper-clad board and the application thereof, brominated polystyrene, decabromodiphenyl ethane and the like are adopted to serve as sources of the bromine, phosphazene, melamine polyphosphate, aluminum metaphosphate or melamine cyanurate and the like serve as sources of the phosphorus, the proportion of the flame retardant additives containing the phosphorus and the flame retardant additives containing the bromine of the composition is adjusted to make the bromine content controlled between 5% and 12% and make the phosphorus content controlled between 0.2% and 1.5%, and the flame retardancy of the composition can reach grade UL94 V-0; compared with a pure-bromine flame-retardant copper-clad board, the heat resistance is higher, and a higher CTI value can be reached; compared with a pure-phosphorus flame-retardant copper-clad board, the rate of moisture absorption is lower, and the adhesive property and the technological operability which are needed for printing circuit substrates can be provided; compared with a traditional board which has a high CTI and adopts a large amount of aluminum hydroxide, by means of the epoxy resin composition for the copper-clad board, the CTI can reach to be above 600 V by utilizing a small amount of the aluminum hydroxide or not utilizing the aluminum hydroxide at all.

Description

technical field [0001] The invention relates to the technical field of laminated boards, in particular to an epoxy resin composition, and in particular to an epoxy resin composition for copper-clad laminates and prepregs, laminated boards and printed circuit boards made thereof. Background technique [0002] With the official implementation of the EU directives WEEE (Waste Electrical and Electronic Equipment) and RoHS (Restriction of Hazardous Substances), the global electronics industry has entered the era of lead-free soldering. Due to the increase of lead-free soldering temperature, higher requirements are put forward for the heat resistance and thermal stability of printed circuit copper clad laminates. Affected by the "green" regulations issued by the European Union, whether bromine should be used as a flame retardant element in the field of polymers has been pushed to the cusp of controversy. Although tetrabromobisphenol A has not been found to have any significant ne...

AI Technical Summary

Problems solved by technology

However, phosphorus element is easy to absorb moisture, and the moisture absorption rate of the flame-retardant board solely relying on phosphorus element is high, which is not conducive to the stability of the electrical properties of the board; and the current phosphorus-based flame retardants are generally expensive, and the cost pressure is relatively high. Therefore, although for There is a high demand for halogen-free, but it is currently unlikely to abandon bromine flame retardancy due to cost reasons

Chinese patent CN102093670A discloses a method for realizing flame retardancy with phosphorus-containing phenolic aldehydes containing 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) structure, although the water absorption of DOPO is lower It is lower than phosphoric acid ester, but due to its large dosage and phosphorus content above 2%, the moisture absorption rate has not been improved.

[0005] Although CN101892027 and CN101808466 disclose the sharing of bromine and phosphorus, both of them use a large amount of nitrile rubber, and the water absorption rate increases seriously, thereby reducing the withstand voltage of the composite substrate, and the acrylonitrile structure in the nitrile rubber will accelerate The decomposition of bromine is detrimental to the CTI performance of bromine-containing systems

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