Active thermoelectric cooling system for electronic device in severe working conditions

Abstract

The present invention provides an active thermoelectric cooling system for an electronic device in severe working conditions. A cold end of a thermoelectric module component is connected with a heating position of the device; a passive cooling module is connected with a hot end of the thermoelectric module component; a temperature control assemblycomprises a temperature sensor, a microprocessor and a driving power supply; the temperature sensor is placed between the device and the cold end of the thermoelectric module component, in order to test the temperature of an object to be cooled and send the temperature to the microprocessor; the microprocessor calculates an appropriate drive voltage of the driving power supply according to a set temperature and the testing temperature for further driving the thermoelectric module component. According to the present invention, the thermoelectric module is used for actively cooling the device, deficiencies of traditional passive cooling can be overcome in severe working environments, and the device cooling requirements are satisfied; an energy-saving temperature control strategy is used for the unidirectional cooling and self-cooling of the device, so that the device can work at a relatively low temperature, while the condensation problem due to the device temperature lower than the dew point temperature is avoided.

Description

technical field [0001] This patent relates to active thermoelectric cooling technology for electronic devices, such as lasers, LEDs, power devices and other devices that are sensitive to temperature; Active thermoelectric cooling system for electronic devices under harsh working conditions for energy saving. Background technique [0002] With the development of electronic engineering, heat dissipation is becoming a more and more concerned issue. With the increase of power brought by the improvement of integration level, the temperature of the device will inevitably rise, resulting in a harsh environment. At the same time, for some optoelectronic devices, precise temperature control is crucial, and it must work at a lower temperature, which puts higher demands on the cooling system. [0003] The heat generated by the electronic device during operation will reduce the reliability of its operation, which in turn will endanger the reliability of the entire electronic system, an...

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Problems solved by technology

Patent CN201410141231 embeds the thermoelectric chip into the circuit board, but there is no heat dissipation device at the hot end, which is a major defect, and the thermoelectric module will not work efficiently

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