Substrate alignment mechanism and substrate alignment method

Abstract

The invention provides a substrate alignment mechanism and a substrate alignment method. The substrate alignment mechanism of the present invention can reduce the frictional force generated by the relative position movement between the substrate and the support column during alignment by arranging balls on the top of the support column, avoid scratches on the back of the substrate, and improve substrate thinning failure. In the substrate alignment method of the present invention, by setting the above-mentioned substrate alignment mechanism in the substrate transfer equipment, the friction force generated by the relative position movement of the substrate and the support column during the alignment process is reduced, and scratches on the back of the substrate are avoided. Thus, poor substrate thinning is improved. In another substrate alignment method of the present invention, by setting the above substrate alignment mechanism in the substrate rotation equipment, the friction force generated by the relative position movement of the substrate and the support column during the alignment process is reduced, and scratches on the back of the substrate are avoided. , thereby improving poor substrate thinning.

Description

technical field [0001] The invention relates to a panel production equipment and process, in particular to a substrate alignment mechanism and a substrate alignment method. Background technique [0002] The alignment of the substrate is an essential action when the transfer equipment and the substrate enter the process equipment. The main purpose is to correct the position of the substrate, so that the position of the substrate when entering the process equipment is accurate, and to ensure that the process equipment can smoothly carry out the next process. And prevent the substrate from interfering with the equipment during the transmission process due to positional misalignment, resulting in missing corners or fragments. [0003] see Figure 1 to Figure 3 , is a schematic diagram of an existing substrate alignment mechanism. The substrate alignment mechanism includes a plurality of support columns 100 and a plurality of alignment columns 200 located on both sides of the pl...

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned substrate alignment mechanism mainly relies on the thrust of the cylinder (not shown) to correct the position of the substrate 300 during alignment. During the alignment process, there is relative movement friction between the substrate 300 and several support columns 100, which may easily cause the substrate to lose its position. Scratches on the back of 300, scratches on the back of the substrate 300 will cause poor thinning of the substrate in the post-processing process, and eventually lead to downgraded shipments or scrapping of products

[0005] Therefore, it is necessary to provide a new substrate alignment mechanism and substrate alignment method to solve the scratches on the back of the substrate due to the relative positional movement friction between the substrate and the support column during the existing substrate alignment process. In turn, it causes the problem of poor thinning of the substrate in the post-process

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