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A kind of fixed abrasive polishing roller for roll-to-roll chemical mechanical polishing machine and preparation method thereof

A technology of fixed abrasives and chemical machinery, applied in grinding/polishing equipment, abrasives, grinding devices, etc., can solve the problems of decreased material removal rate, inconsistent material removal rate, low efficiency, etc., and achieve uniform material removal rate. , The material removal rate is consistent, and the effect of improving polishing efficiency

Inactive Publication Date: 2018-08-17
HENAN INST OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] (1) When the Roll-to-Roll polishing machine adopts the traditional free abrasive chemical mechanical polishing technology to polish ultra-thin flexible substrate materials, the free abrasive particles are caused The unevenness of the distribution between the polishing roller and the workpiece makes the material removal rate of each part of the workpiece inconsistent and affects the surface flatness
(2) Since the polishing liquid contains abrasives, some abrasive particles will be embedded on the surface of the workpiece after polishing, which is not easy to clean
(3) Due to the complex composition of the polishing liquid, the removal of the residual polishing liquid on the surface of the workpiece after polishing is a difficult problem for cleaning after CMP
(4) The surface of the free abrasive polishing roller is prone to plastic deformation during polishing, and its surface gradually becomes smooth or the micropores are blocked, which reduces its ability to accommodate polishing fluid and remove waste debris, resulting in a decrease in material removal rate over time
Requires constant conditioning and wetting of the polishing pad to restore its surface roughness and porosity, resulting in inefficiencies
(5) When the Roll-to-Roll polishing machine is fixed abrasive chemical mechanical polishing, if there is only a rigid layer and no elastic layer, the surface of the processed workpiece will be severely scratched, the damage will be high, and the surface quality will be low
[0012] (1) When the Roll-to-Roll polishing machine adopts the traditional free abrasive chemical mechanical polishing technology to polish ultra-thin flexible substrate materials, the distribution of free abrasive particles between the polishing roller and the workpiece is uneven, so that the workpiece is Partial material removal rate is inconsistent, affecting surface flatness
(2) Since the polishing liquid contains abrasives, some abrasive particles will be embedded on the surface of the workpiece after polishing, which is not easy to clean
(3) Due to the complex composition of the polishing liquid, the removal of the residual polishing liquid on the surface of the workpiece after polishing is a difficult problem for cleaning after CMP
(4) The surface of the free abrasive polishing roller is prone to plastic deformation during polishing, and its surface gradually becomes smooth or the micropores are blocked, which reduces its ability to accommodate polishing fluid and remove waste debris, resulting in a decrease in material removal rate over time
Requires constant conditioning and wetting of the polishing pad to restore its surface roughness and porosity, resulting in inefficiencies

Method used

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  • A kind of fixed abrasive polishing roller for roll-to-roll chemical mechanical polishing machine and preparation method thereof
  • A kind of fixed abrasive polishing roller for roll-to-roll chemical mechanical polishing machine and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] The basic structure of the present invention is:

[0047] Both sides of the fixed abrasive polishing roller are respectively provided with a polishing roller left end support mechanism 1 and a polishing roller right end support mechanism 5, and the outer side of the fixed abrasive polishing roller 6 is provided with a fixed abrasive polishing roller matrix layer 4, and the fixed abrasive polishing roller The outer side of the base layer is provided with an elastic layer 3 , and the outer side of the elastic layer is provided with a rigid layer 2 .

[0048] A preparation method for a Roll-to-Roll chemical mechanical polishing machine with a fixed abrasive polishing roller, comprising the following steps:

[0049] (1) Prepare a number of glassware and stirrers,

[0050] (2) Select according to the formula of the rigid layer: abrasives, photocurable resins, reactive diluents, photoinitiators, accelerators, surface property modifiers, auxiliary agents, fillers, and pigment...

Embodiment 2

[0074] Preparation method is the same as embodiment 1, and the material selection of concrete rigid layer and elastic layer is:

[0075] Rigid layer: Weigh 70g of white corundum abrasive with a particle size of 14μm, 150g of urethane acrylate (aliphatic) with a functionality of 4, 150g of urethane acrylate (aromatic) with a functionality of 4, and 120g of polystyrene with a functionality of 4. Acrylates, 360g pentaerythritol triacrylate, 40g 2-hydroxy-2-methyl-1-phenylacetone, 10g 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 5g polydimethyl Base silicone oil, 20g modified polysiloxane, 25g polyethylene wax, 30g 2,6-di-tert-butyl p-cresol, 18g talc, 2g pigment yellow (PY129).

[0076] Elastic layer: Weigh 300g of urethane acrylate (aliphatic) with a functionality of 3, 200g of urethane acrylate (aromatic) with a functionality of 3, 200g of 1,6-hexanediol diacrylate, 1-hydroxy ring 50g of hexyl phenyl ketone, 5g of tributyl phosphate, 40g of p-hydroxyanisole, 5g of walnut sh...

Embodiment 3

[0078] Preparation method is the same as embodiment 1, and the material selection of concrete rigid layer and elastic layer is:

[0079] Rigid layer: Weigh 60g of white corundum abrasive with a particle size of 7μm, 150g of polyurethane acrylate (aliphatic) with a functionality of 4, 150g of polyurethane acrylate with a functionality of 4 (aromatic), and 120g of modified epoxy acrylate , 200g pentaerythritol triacrylate, 170g pentaerythritol tetraacrylate, 40g 2-hydroxy-2-methyl-1-phenylacetone, 10g 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 10g Dimethicone, 20g modified polysiloxane, 15g aluminum stearate, 5g tung oil, 20g 2,6-di-tert-butyl-p-cresol, 18g talcum powder, 10g kaolin, 2g phthalocyanine blue (PB15) .

[0080] Elastic layer: Weigh 100g of polyester acrylate with a functionality of 3, 300g of polyurethane acrylate (aliphatic) with a functionality of 3, 400g of diethylene glycol diacrylate, and 40g of 1-hydroxycyclohexyl phenyl ketone , 40g of ethyl 2,4,6-trim...

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Abstract

The invention discloses a fixed abrasive polishing roller for a Roll-to-Roll chemical mechanical polishing machine and a preparation method thereof. The main points of the technical scheme of the invention are: both sides of the fixed abrasive polishing roller are respectively provided with a left end support mechanism of the polishing roller And the support mechanism at the right end of the polishing roller, the fixed abrasive polishing roller is provided with a fixed abrasive polishing roller base layer, the outer part of the fixed abrasive polishing roller base layer is provided with an elastic layer, and the outer part of the elastic layer is provided with a rigid layer. The surface of the polishing roller of the present invention is not easy to produce plastic deformation, and the surface pores are not easy to be blocked, and its ability to accommodate polishing liquid and remove waste will not decrease with time, and the material removal rate is uniform; efficiency.

Description

technical field [0001] The present invention relates to ultra-precision processing technology in the manufacture of microelectronics, optoelectronics, and flexible display substrates, in particular to a consolidated abrasive polishing roller for a Roll-to-Roll chemical mechanical polishing machine and a preparation method thereof. Background technique [0002] Microelectronics, optoelectronics, and integrated circuit manufacturing are one of the important symbols to measure a country's status and comprehensive national strength. It is the most competitive and fastest-growing field in the world today. Only by mastering advanced microelectronics and optoelectronics manufacturing technology can effective cost control be achieved. Only by expanding the scale of production can we survive and develop in the fierce market competition. As the basic industry, leading industry, pillar industry and strategic industry of the national economy, advanced manufacturing of microelectronics a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D3/28B24D18/00
Inventor 苏建修王占奎张文庆张伟杨辉王雅慧张骞郑丽媛
Owner HENAN INST OF SCI & TECH
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