IC card

A technology of insulating substrates and chips, applied in printing, instruments, electrical components, etc., can solve problems such as unsatisfactory elimination of deformation of reinforcing sheets, uneven surface of card substrates, heating of heat-sensitive recording layers, etc.

Inactive Publication Date: 2004-09-15
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially when a reinforcing sheet is used together with a sealing resin having curing shrinkage properties, the reinforcing sheet may be deformed due to curing shrinkage of the sealing resin
For this reason, when an IC module with a reinforcing sheet provided on an IC chip is sealed between resin sheets (card substrates) with a sealing resin, the deformation of the reinforcing sheet cannot be satisfactorily eliminated by means of the card substrate, Therefore the surface of the card base may become uneven
[0011] In a card substrate having an uneven surface, when the thermosensitive recording layer is subjected to a printing operation, a gap will be generated between the thermosensitive recording layer and the thermal head, so that the thermosensitive recording layer cannot be satisfactorily heated, sometimes Issues similar to loss of image records may occur

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0108] In the IC card of Example 1, the Figure 10 The IC module 1 shown in plan view (viewed from the top of the reinforcement sheet 16, this also applies to subsequent views) in which the reinforcement film pattern 13 is provided only on the IC mounting surface. The reinforcing film pattern 13 is a square, and the length of one side is 0.5 mm shorter than the diameter of the reinforcing sheet 16, that is, a square whose outer periphery is 6.5 mm×6.5 mm. In addition, in the reinforcing film pattern 13, the shape of the opening 13a is a square, and the length of one side is 0.3mm longer than the side of the square IC chip 14, that is, the shape of the opening 13a is a square of 4.3mm×4.3mm. The outer sides of the reinforcing film pattern 13 are parallel to the corresponding sides of the opening 13a. Furthermore, the reinforcement film pattern 13 can be obtained by forming a pattern in the same conductive film as that used for the circuit pattern 12, so that a bypass is formed...

example 2

[0111] In the IC card of example 2, used such as Figure 11 In the shown IC module, the reinforcing film patterns 13, 13' are respectively provided on the IC mounting surface and the non-mounting surface. The shape and structure of the reinforcement film pattern 13 on the mounting surface of the IC chip 14 and the reinforcement sheet 16 are the same as those in Example 1. The reinforcing film pattern 13' on the non-mounting surface has the same outer peripheral shape as that of the reinforcing film pattern 13 on the mounting surface and has an opening 13a'. No bypass pattern is formed at the portion where the circuit pattern 12 is formed in the reinforcing film pattern 13', and only a square opening 13a' is formed in the center of the square pattern in the same direction.

[0112] The reinforcing film pattern 13, the IC chip 14, the reinforcing sheet 16 and the reinforcing film pattern 13' having the above-mentioned shape are arranged so that the IC chip 14 is arranged in the...

example 3

[0114] In the IC card of example 3, used such as Figure 12 In the IC module shown in , wherein the reinforcing film pattern 13' is provided only on the non-mounting surface of the IC chip 14. The structures of the IC chip 14, the reinforcement sheet 16 and the reinforcement film pattern 13' are the same as in Example 2.

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Abstract

An IC card having high reliability, which is not only in that printing can be surely conducted with respect to the reversible display layer provided on the surface of the card substrate, but also in that the IC chip is surely protected by the reinforcing sheet. An IC card which has: an IC module (1) including an IC chip (14) mounted on an insulating substrate (11), and a reinforcing sheet (16) provided over the IC chip (14) through a sealing resin (15) for sealing the IC chip (14); a card substrate (2) comprised of a resin for sealing the IC module (1); and a reversible recording layer (3) provided on at least one surface of the card substrate (2), wherein reinforcing film patterns (13), (13') having openings (13a), (13a') which expose the IC chip (14) mounted portion are provided on at least one of the IC chip (14) mounted surface and the non-mounted surface of the insulating substrate (11).

Description

technical field [0001] The present invention relates to an information recording card with an information recording medium used in ID cards (identity cards), membership cards, prepaid cards, automatic withdrawal cards and monthly tickets, and in particular to an information recording card with electronic data information and visible information Functional non-contact IC information recording card (information recordingnon-contact IC card). Background technique [0002] Information recording cards including identification cards and credit cards using methods of magnetically or optically reading data have been widely used. However, due to the popularization of technology, the data in the magnetic card is easily changed or the counterfeit magnetic card is spread. In fact, the losses that people suffer from counterfeiting magnetic cards are increasing day by day, and at the same time, social problems involving personal privacy have been caused. For this reason, in recent years...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B42D15/10G06K9/00G06K19/06G06K19/07G06K19/077H01L23/12H01L25/00
CPCG06K19/07749G06K2019/06281H01L2924/07811G06K19/06046G06K19/07728H01L2224/73204G06K19/077G06K19/07745H01L2924/00
Inventor 太田荣治石井修
Owner SONY CORP
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